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N74F534D

Onsemi

N74F534D by Onsemi

N74F534D by Onsemi is an 8-function latch with a 5V supply, operating b/w 0-70 °C. It features a max frequency of 135MHz and output characteristics in 3-state. This TTL technology chip is ideal for applications requiring positive edge triggering in commercial temperature grades.

Median Price

$0.613

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 152 parts In-Stock

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$0.613

100+ parts

$0.644

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$0.607

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152

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J2 Sourcing AB

Sweden . 3,942 parts In-Stock

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Vyrian

USA . 3,727 parts In-Stock

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Digiode

USA . 1,185 parts In-Stock

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Anansix

USA . 429 parts In-Stock

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GES GmbH

Germany . 35 parts In-Stock

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EMSNET

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Distributors (Availability)

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Corohmni

South Africa . 450 parts In-Stock

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$0.613

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One Stop Electronics

USA . 1,500 parts In-Stock

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$26.000

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TANS Electronics

Latvia . 6,111 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,123 parts In-Stock

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Corphita

USA . 3,944 parts In-Stock

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UNI Independent Distributors

Spain . 3,289 parts In-Stock

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Kulean Microsystems

USA . 1,813 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 418 parts In-Stock

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UHIMA Technologies

Türkiye . 388 parts In-Stock

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Overview

Discover the seamless performance and reliability of the N74F534D by Onsemi. Crafted with precision and expertise, this latches & flip-flops device offers unparalleled quality and durability. Ideal for a wide range of applications, this product provides customers with unmatched value and benefits. Trust in Onsemi to deliver innovative solutions that exceed expectations, giving you the competitive edge you need. Experience the difference with the N74F534D.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the latch or flip-flop, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and enabling efficient PCB design.

No. of Functions: 8

Provides versatility and flexibility in terms of functionality, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power supply voltages, making it easy to integrate into existing systems.

Trigger Type: POSITIVE EDGE

Offers precise control over the triggering of the latch or flip-flop, allowing for accurate timing in operations.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for use in environments where heat may be a concern.

Technology: TTL

Uses TTL technology known for its reliability and compatibility with a wide range of systems and components.

Technical Specifications

Latches & Flip-Flops N74F534D attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Logic IC Type:

Maximum Frequency At Nominal Supply:

135000000 Hz

Maximum I (ol):

24 Amp

No. of Functions:

8

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

86 mA

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Trade Compliance

N74F534D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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