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N74F109N

NXP Semiconductors

N74F109N by NXP Semiconductors

N74F109N by NXP Semiconductors is a TTL dual flip-flop with a 5V supply, featuring a max frequency of 90 MHz and propagation delay of just 9.2 ns. It operates in temperatures from 0 °C to 70 °C, making it ideal for commercial applications. With a compact design and through-hole terminals, it's perfect for various electronic circuits.

Median Price

$0.380

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 12 parts In-Stock

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$0.380

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$0.290

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12

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Vyrian

USA . 7,243 parts In-Stock

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Digiode

USA . 2,974 parts In-Stock

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Extreme Components

USA . 1,675 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,000 parts In-Stock

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Anansix

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Mil-Aero Solutions, Inc.

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Prism Electronics

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Resion

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Distributors (Availability)

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AZTECH Wire

Italy . 9,249 parts In-Stock

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$0.380

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One Stop Electronics

USA . 569 parts In-Stock

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UNI Independent Distributors

Spain . 8,329 parts In-Stock

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Corphita

USA . 3,961 parts In-Stock

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Supply Digital

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Assy Fe

Spain . 2,028 parts In-Stock

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Infinite Electronics LLP (Excess)

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Perfect Parts

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Overview

Unlock unparalleled performance with the N74F109N from NXP Semiconductors, a leader in innovation and quality. This versatile latch and flip-flop solution enhances your designs with superior reliability and rapid response times, making it ideal for applications ranging from consumer electronics to industrial automation. Experience the benefits of robust engineering and commitment to excellence that only NXP can provide, ensuring your projects succeed with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures longevity and reliability in various applications.

No. of Functions: 2

With dual functionality, it provides versatile solutions for complex tasks, saving space and cost.

Package Shape: RECTANGULAR

Rectangular design aids in efficient space management on PCBs, enabling denser circuit arrangements.

No. of Bits: 2

Two bits allow for processing of more information simultaneously, enhancing performance in embedded systems.

Nominal Supply Voltage / Vsup: 5 V

Standard supply voltage makes it compatible with most digital circuits, promoting ease of integration.

Load Capacitance (CL): 50 pF

Low load capacitance helps in maintaining signal integrity, crucial for high-speed applications.

Power Supplies (V): 5

Single voltage requirement simplifies power management in electronic designs.

No. of Terminals: 16

Ample connectivity options facilitate versatile circuit designs, accommodating various configurations.

Package Style (Meter): IN-LINE

In-line configuration supports efficient routing on circuit boards, ideal for dense applications.

Maximum I (ol): 20 Amp

High output current capability supports powerful signal driving, suitable for demanding applications.

Propagation Delay (tpd): 9.2 ns

Short propagation delay enhances performance in high-speed circuits, making it suitable for modern digital applications.

Maximum Operating Temperature: 70 °C

High temperature tolerance allows operation in various environments without the risk of failure.

Trigger Type: POSITIVE EDGE

Positive edge triggering enhances responsiveness and synchronization in digital circuits.

Minimum Operating Temperature: 0 °C

Wide temperature range ensures reliable operation in diverse environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal position supports flexible mounting and enhances circuit layout efficiency.

Maximum Seated Height: 4.2 mm

Compact height allows for dense packing in circuit designs, conserving space.

Width: 7.62 mm

Standard width facilitates compatibility with common circuit board layouts for easy integration.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides flexibility in driving various circuit configurations.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum voltage requirement ensures functionality in battery-operated or lower power applications.

Maximum Time At Peak Reflow Temperature (s): 40

Extended time at peak reflow matches industry standards, ensuring reliability post-manufacturing.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures compatibility with standard soldering processes in PCB assembly.

Length: 19.025 mm

Standard length aids compatibility and simplifies design integration in various applications.

Temperature Grade: COMMERCIAL

Commercial grade ensures reliable performance in everyday applications without overly aggressive specifications.

Maximum Frequency At Nominal Supply: 90000000 Hz

High maximum frequency capability supports advanced applications, suitable for high-speed digital circuits.

Technology: TTL

Using TTL technology provides reliable performance and compatibility with a wide range of digital systems.

Terminal Form: THROUGH-HOLE

Through-hole design enhances mechanical stability and ease of soldering in prototyping and production.

Terminal Pitch: 2.54 mm

Standard pitch makes it easier to interface with existing designs and components, reducing design complexity.

Minimum fmax: 90 MHz

Minimum frequency capability ensures performance in a variety of applications, from moderate to high speed.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for slight voltage variance, ensuring stable operation under varying conditions.

Maximum Power Supply Current (ICC): 17 mA

Low current consumption promotes energy efficiency, making it suitable for low-power applications.

Technical Specifications

Latches & Flip-Flops N74F109N attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

90000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

17 mA

Propagation Delay (tpd):

9.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

90 MHz

Trade Compliance

N74F109N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-366-2708, 5962013662708

NIIN

013662708

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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