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N74F112D

NXP Semiconductors

N74F112D by NXP Semiconductors

N74F112D by NXP Semiconductors is a TTL dual-function latch with a 5V nominal voltage and operates at up to 80 MHz. It features a low propagation delay of 7.5 ns and supports surface mount applications in compact designs. Ideal for digital circuits requiring fast, reliable data storage.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Speed Components Ltd

Israel . 3,410 parts In-Stock

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Digiode

USA . 3,369 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,500 parts In-Stock

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Anansix

USA . 2,492 parts In-Stock

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A2Z Electronics, Inc.

USA . 2,382 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,021 parts In-Stock

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Vyrian

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PC Components Company LLC

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Semi Source

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Bristol Electronics

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One Stop Electronics

USA . 701 parts In-Stock

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Perfect Parts

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UNI Independent Distributors

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A-Z Elektronik GmbH

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Corphita

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Cyclops Electronics Ltd (Excess)

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Authorized Procurement Solutions

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Kepictronics

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Overview

Elevate your designs with the N74F112D from NXP Semiconductors—a trusted leader in innovative electronics. This robust latch and flip-flop solution enhances performance while ensuring reliability across diverse applications, from consumer electronics to industrial automation. With exceptional speed and efficiency, it delivers seamless integration and durability, empowering you to create cutting-edge products that stand out in today’s competitive landscape. Choose NXP for quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability while keeping the costs low, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on the PCB, enabling more compact and efficient circuit designs.

No. of Functions: 2

Having two functions makes this product versatile, enabling it to serve multiple purposes within a single device.

Package Shape: RECTANGULAR

The rectangular shape is standardized, making it easy to integrate into existing designs and layouts.

No. of Bits: 2

The 2-bit architecture allows for simple data manipulation, making it perfect for low-complexity applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V makes it compatible with a wide range of devices and circuits.

Load Capacitance (CL): 50 pF

Low load capacitance ensures faster switching times, enhancing the performance of digital circuits.

Power Supplies (V): 5

Supports commonly used power supplies, simplifying design considerations and integration with existing systems.

No. of Terminals: 16

A higher number of terminals provide flexibility for connections, allowing more functionalities in a compact form.

Package Style (Meter): SMALL OUTLINE

Small outline packages are designed for space-saving applications, ideal for modern electronic devices.

Maximum I (ol): 20 Amp

High output current capability allows it to drive larger loads, suitable for a variety of applications.

Propagation Delay (tpd): 7.5 ns

The short propagation delay enhances overall circuit speed, making it suitable for high-frequency applications.

Maximum Operating Temperature: 70 °C

Withstanding up to 70 °C makes it reliable for use in environments with higher ambient temperatures.

Trigger Type: NEGATIVE EDGE

Negative edge triggering is ideal for synchronizing with other digital signals, ensuring reliable data transfer.

Minimum Operating Temperature: 0 °C

The operating temperature range allows for usage in various environments, increasing application versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances reliability and longevity, providing better resistance to corrosion and wear.

Terminal Position: DUAL

Dual terminal positioning improves the electrical performance and layout options on the PCB.

Output Polarity: COMPLEMENTARY

Complementary output polarity allows for reduced power consumption and improved signal integrity in digital circuits.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum supply voltage flexibility makes it suitable for battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes without damaging the device.

Peak Reflow Temperature °C: 260

This withstands peak temperatures, making it reliable and efficient during manufacturing processes.

Temperature Grade: COMMERCIAL

A commercial temperature grade makes it suitable for a wide range of consumer and industrial applications.

Maximum Frequency At Nominal Supply: 80000000 Hz

High frequency capacity enables use in fast-switching applications, enhancing overall system performance.

Technology: TTL

TTL technology offers faster switching and better noise immunity, improving reliability in digital applications.

Terminal Form: GULL WING

Gull wing terminals allow for ease of soldering, improving assembly efficiency and reliability.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides ample space for connections, reducing the risk of solder bridging.

Minimum fmax: 80 MHz

A minimum operating frequency of 80 MHz ensures compatibility with various high-speed applications.

Maximum Supply Voltage (Vsup): 5.5 V

It offers a generous maximum supply voltage tolerance, providing stability and performance across a range of conditions.

Maximum Power Supply Current (ICC): 21 mA

With a maximum current of 21 mA, it balances power efficiency and operational capacity effectively.

Technical Specifications

Latches & Flip-Flops N74F112D attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

80000000 Hz

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

21 mA

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

NEGATIVE EDGE

Minimum fmax:

80 MHz

Trade Compliance

N74F112D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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