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N74F273AN,602

NXP Semiconductors

N74F273AN,602 by NXP Semiconductors

D FLIP-FLOP; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.182

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 549 parts In-Stock

1+ parts

-

100+ parts

$1.160

1k+ parts

$0.963

10k+ parts

$0.858

549

-

$1.160

$0.963

$0.858

Verical

USA . 441 parts In-Stock

1+ parts

-

100+ parts

-

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$1.204

10k+ parts

$1.073

441

-

-

$1.204

$1.073

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 557 parts In-Stock

1+ parts

$0.463

100+ parts

-

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557

$0.463

-

-

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Vyrian

USA . 8,902 parts In-Stock

1+ parts

-

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8,902

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Anansix

USA . 2,505 parts In-Stock

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2,505

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,056 parts In-Stock

1+ parts

$0.438

100+ parts

-

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-

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4,056

$0.438

-

-

-

AZTECH Wire

Italy . 235 parts In-Stock

1+ parts

$13.990

100+ parts

-

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235

$13.990

-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,731 parts In-Stock

1+ parts

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20,731

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Microchip USA

USA . 5,772 parts In-Stock

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5,772

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UNI Independent Distributors

Spain . 3,726 parts In-Stock

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3,726

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Perfect Parts

USA . 202 parts In-Stock

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202

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Technical Specifications

Latches & Flip-Flops N74F273AN,602 attributes and parameters. Explore more Latches & Flip-Flops devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

125000000 Hz

Maximum I (ol):

20 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

43 mA

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

125 MHz

Trade Compliance

N74F273AN,602 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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