Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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NX3P1107UKZ
NXP Semiconductors
NX3P1107UKZ from NXP Semiconductors is a robust peripheral driver designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact square package with 4 terminals and supports power supplies of 1.2V/3.3V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.
1
S-PBGA-B4
4
85 Cel
-40 Cel
PLASTIC/EPOXY
FBGA
BGA4,2X2,20
SQUARE
GRID ARRAY, FINE PITCH
1.2/3.3
Not Qualified
Peripheral Drivers
YES
INDUSTRIAL
BALL
.5 mm
BOTTOM
NX18P3001UKZ
NX18P3001UKZ by NXP Semiconductors is a Peripheral Driver with 12 terminals, operating at -40 to 85°C. It has a voltage range of 5.4-16V and comes in a rectangular plastic/epoxy package suitable for industrial applications. The package style is grid array with fine pitch, making it ideal for surface mount designs.
R-PBGA-B12
12
BGA12,3X4,16
RECTANGULAR
5,4/16
.4 mm
NX5P2090UKZ
NX5P2090UKZ by NXP Semiconductors is a Peripheral Driver with 9 terminals, operating voltage range of 4-5.5V, and built-in protections for over/under voltage & current. Ideal for industrial applications requiring precise power management in compact spaces due to its small form factor and temperature range of -40 to 85°C.
OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
S-PBGA-B9
1.36 mm
9
.015 A
VFBGA
BGA9,3X3,16
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
5
IEC-60134
.55 mm
5.5 V
4 V
5 V
BUK217-50YT,118
BUK217-50YT,118 from NXP Semiconductors is a robust MOS peripheral driver designed for automotive applications. It operates within a voltage range of 5.5 to 35V and supports a max output current of 10A. With a wide temp range (-40 °C to 150 °C), it ensures reliability in extreme conditions.
150 Cel
10 A
SMSIP5H,.6,67TB
5.5/35
MOS
AUTOMOTIVE
1.7 mm
SINGLE
BUK101-50GL127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: TO-220; Package Shape: RECTANGULAR; JESD-30 Code: R-PSFM-T3;
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
R-PSFM-T3
e3
3
SINK
TO-220
FLANGE MOUNT
NO
Matte Tin (Sn)
THROUGH-HOLE
BUK202-50Y127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 5; Package Code: TO-220; Package Shape: RECTANGULAR; JESD-30 Code: R-PSFM-T5;
R-PSFM-T5
SOURCE
20 A
ZIP5,.15,.17,67TB
5/40
40 V
13 V
BUK214-50Y,118
Peripheral Drivers; Temperature Grade: AUTOMOTIVE; No. of Terminals: 5; Power Supplies (V): 5.5/35; Terminal Position: SINGLE; Surface Mount: YES;
12 A
BUK101-50GS,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: TO-220; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TRANSIENT; OVER CURRENT; THERMAL
TIN
BUK117-50DL,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: TO-220; Package Shape: RECTANGULAR; Turn-off Time: 60 us;
OVER CURRENT; OVER VOLTAGE; THERMAL
60 us
20 us
BUK118-50DL,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: TO-220; Package Shape: RECTANGULAR;
16 A
24 A
SIP3,.1TB
2.54 mm
140 us
30 us
BUK124-50L,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 5; Package Code: ZIP; Package Shape: RECTANGULAR;
R-PZFM-T5
30 A
44 A
ZIP
15
15 V
ZIG-ZAG
5 us
BUK125-50L,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 5; Package Shape: RECTANGULAR; Qualification: Not Qualified;
62 A
NOT SPECIFIED
BUK130-50DL,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 2; Package Code: TO-263; Package Shape: RECTANGULAR; JESD-30 Code: R-PSSO-G2;
R-PSSO-G2
10 mm
2
43 A
TO-263
SMALL OUTLINE
4.5 mm
GULL WING
120 us
50 us
BUK148-50DL,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: HSIP; Package Shape: RECTANGULAR; Surface Mount: NO;
R-PSIP-T3
HSIP
IN-LINE, HEAT SINK/SLUG
245
12.95 mm
40
70 us
4.3 mm
BUK149-50DL,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: HSIP; Package Shape: RECTANGULAR; Maximum Seated Height: 12.95 mm;
BUK209-50Y,127
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
6 A
35 V
80 us
BUK210-50Y,127
9 A
200 us
BUK219-50Y,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 5; Package Code: TO-220; Package Shape: RECTANGULAR;
2 A
90 us
PIP3103-T,115
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e3;
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
R-PDSO-G4
6.5 mm
SOP
1.8 mm
2.3 mm
DUAL
65 us
12 us
3.5 mm
PIP3104-P,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: TO-220; Package Shape: RECTANGULAR; Nominal Supply Voltage: 13 V;
PIP3105-P,127
MATTE TIN
PIP3115-B,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 2; Package Code: TO-263; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
PIP3119-P,127
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: THROUGH-HOLE; No. of Terminals: 3; Package Code: TO-220; Package Shape: RECTANGULAR; Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL;
PIP3201-A,127
PIP3207-DC,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TO-263; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
R-PSSO-G6
6
8 A
1.27 mm
400 us
PIP3208-A,127
PIP3209-R,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: TO-263; Package Shape: RECTANGULAR; Terminal Pitch: 1.7 mm;
R-PSSO-G4
PIP3210-R,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: TO-263; Package Shape: RECTANGULAR; Output Current Flow Direction: SINK;
PIP3213-R,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: TO-263; Package Shape: RECTANGULAR;
18 A
115 us
225 us
UBA2024P/N1,112
HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
HALF BRIDGE BASED PERIPHERAL DRIVER
R-PDIP-T8
e4
9.5 mm
8
SOURCE AND SINK
.22 A
DIP
IN-LINE
4.2 mm
13.3 V
11.7 V
12.5 V
NICKEL PALLADIUM GOLD
7.62 mm
UBA2021T/N2,518
HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G14
8.65 mm
14
260
1.75 mm
6.5 V
3.9 mm
UBA2021T/N2,512
PIP401,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TO-263; Package Shape: RECTANGULAR; Surface Mount: YES;
TRANSIENT; THERMAL
400 A
20 V
6.3 V
.3 us
10 us
PIP3102-R,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 5; Package Code: TO-263; Package Shape: RECTANGULAR; No. of Functions: 1;
R-PSSO-G5
BUK224-50Y,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: TO-263; Package Shape: RECTANGULAR; Width: 10 mm;
95 us
BUK218-50DY,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TO-263; Package Shape: RECTANGULAR; No. of Functions: 2;
BUK127-50GT,115
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
6.5 us
.9 us
BUK114-50L,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Output Current Flow Direction: SINK; JESD-609 Code: e3; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 30; Qualification: Not Qualified;
30
TJA1010T/N1,118
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G28;
R-PDSO-G28
17.9 mm
28
.3 A
.55 A
SOP28,.4
2.65 mm
13.5 V
11 V
12 V
BCDMOS
7.5 mm
UBA2021P/N2,112
HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
R-PDIP-T14
19.025 mm
UBA2021T/N2,118
UBA2070T/N1,518
HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G16
9.9 mm
16
80 Cel
-25 Cel
13.6 V
12.4 V
COMMERCIAL EXTENDED
MC17XS6400CEKR2
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
MC17XS6400CEK
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
MC08XS6421CEK
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
MC22XS4200CEKR2
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MC22XS4200CEK
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
MC50XS4200CEKR2
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3;
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