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NXP Semiconductors Peripheral Drivers 72

Peripheral Drivers
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Built-in Protections Driver No. of Bits High Side Driver Input Characteristics Interface IC Type JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Output Current Flow Direction Maximum Output Current Nominal Output Peak Current Limit Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Maximum Supply Voltage-1 Minimum Supply Voltage-1 Nominal Supply Voltage-1 Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Turn-off Time Turn-on Time Width
MC50XS4200CEK by NXP Semiconductors

MC50XS4200CEK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

TIN

40

MC17XSG500EKR2 by NXP Semiconductors

MC17XSG500EKR2

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Finish: Tin (Sn); JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

Tin (Sn)

40

MC17XSG500EK by NXP Semiconductors

MC17XSG500EK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Finish: Tin (Sn); Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

Tin (Sn)

40

UBA2024BP/N1,112 by NXP Semiconductors

UBA2024BP/N1,112

NXP Semiconductors

HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

HALF BRIDGE BASED PERIPHERAL DRIVER

R-PDIP-T8

9.5 mm

1

8

150 Cel

-40 Cel

SOURCE AND SINK

PLASTIC/EPOXY

DIP

RECTANGULAR

IN-LINE

4.2 mm

13.3 V

11.7 V

12.5 V

NO

AUTOMOTIVE

THROUGH-HOLE

2.54 mm

DUAL

7.62 mm

UBA2071ATS/N1,118 by NXP Semiconductors

UBA2071ATS/N1,118

NXP Semiconductors

HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

HALF BRIDGE BASED PERIPHERAL DRIVER

R-PDSO-G24

8.2 mm

1

24

100 Cel

-25 Cel

SOURCE AND SINK

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

2 mm

12.6 V

11.4 V

12 V

YES

OTHER

GULL WING

.65 mm

DUAL

5.3 mm

UBA2071TS/N1,118 by NXP Semiconductors

UBA2071TS/N1,118

NXP Semiconductors

HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

HALF BRIDGE BASED PERIPHERAL DRIVER

R-PDSO-G24

8.2 mm

1

24

100 Cel

-25 Cel

SOURCE AND SINK

PLASTIC/EPOXY

SSOP

RECTANGULAR

SMALL OUTLINE, SHRINK PITCH

2 mm

12.6 V

11.4 V

12 V

YES

OTHER

GULL WING

.65 mm

DUAL

5.3 mm

MC08XS6421BEKR2 by NXP Semiconductors

MC08XS6421BEKR2

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

TIN

40

MC08XS6421BEK by NXP Semiconductors

MC08XS6421BEK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

TIN

40

MC17XS6400BEKR2 by NXP Semiconductors

MC17XS6400BEKR2

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: Tin (Sn);

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

Tin (Sn)

40

MC17XS6400BEK by NXP Semiconductors

MC17XS6400BEK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: Tin (Sn); JESD-609 Code: e3;

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

Tin (Sn)

40

MC40XS6500BEKR2 by NXP Semiconductors

MC40XS6500BEKR2

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSOP; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 40;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

5

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G32

e3

11 mm

3

1

32

125 Cel

-40 Cel

SINK

3.9 A

PLASTIC/EPOXY

HSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

8 mA

18 V

7 V

14 V

YES

TIN

GULL WING

.65 mm

DUAL

40

80 us

80 us

7.5 mm

MC07XSG517EK by NXP Semiconductors

MC07XSG517EK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Finish: TIN; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

e3

3

260

TIN

40

MC40XS6500BEK by NXP Semiconductors

MC40XS6500BEK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSSOP; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

5

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G32

e3

11 mm

3

1

32

125 Cel

-40 Cel

SINK

3.9 A

PLASTIC/EPOXY

HSSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

8 mA

18 V

7 V

14 V

YES

TIN

GULL WING

.65 mm

DUAL

40

80 us

80 us

7.5 mm

MC40XS6500CEKR2 by NXP Semiconductors

MC40XS6500CEKR2

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage: 7 V;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

5

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G32

e3

11 mm

3

1

32

125 Cel

-40 Cel

SINK

3.9 A

PLASTIC/EPOXY

HSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

8 mA

18 V

7 V

14 V

YES

TIN

GULL WING

.65 mm

DUAL

40

80 us

80 us

7.5 mm

MC40XS6500CEK by NXP Semiconductors

MC40XS6500CEK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSOP; Package Shape: RECTANGULAR; Package Equivalence Code: SSOP32,.4;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

5

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G32

e3

11 mm

3

1

32

125 Cel

-40 Cel

SINK

3.9 A

PLASTIC/EPOXY

HSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

2.45 mm

8 mA

18 V

7 V

14 V

YES

TIN

GULL WING

.65 mm

DUAL

40

80 us

80 us

7.5 mm

MC07XS6517DEKR2 by NXP Semiconductors

MC07XS6517DEKR2

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: HSSOP; Package Shape: RECTANGULAR; Turn-off Time: 120 us;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

6

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G52

17.9 mm

3

1

52

125 Cel

-40 Cel

SINK

11 A

PLASTIC/EPOXY

HSSOP

SSOP52/54,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

AEC-Q100

2.45 mm

4 mA

5.5 V

4.5 V

5 V

18 V

7 V

12 V

YES

GULL WING

.65 mm

DUAL

40

120 us

120 us

7.5 mm

MC07XS6517DEK by NXP Semiconductors

MC07XS6517DEK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: HSSOP; Package Shape: RECTANGULAR; Width: 7.5 mm;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

6

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G52

17.9 mm

3

1

52

125 Cel

-40 Cel

SINK

11 A

PLASTIC/EPOXY

HSSOP

SSOP52/54,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

260

AEC-Q100

2.45 mm

4 mA

5.5 V

4.5 V

5 V

18 V

7 V

12 V

YES

GULL WING

.65 mm

DUAL

40

120 us

120 us

7.5 mm

MC40XS6500DEKR2 by NXP Semiconductors

MC40XS6500DEKR2

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSOP; Package Shape: RECTANGULAR; Turn-on Time: 80 us;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

5

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G32

11 mm

1

32

125 Cel

-40 Cel

SINK

3.9 A

PLASTIC/EPOXY

HSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

2.45 mm

8 mA

18 V

7 V

14 V

YES

GULL WING

.65 mm

DUAL

80 us

80 us

7.5 mm

MC40XS6500DEK by NXP Semiconductors

MC40XS6500DEK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: HSOP; Package Shape: RECTANGULAR; Output Current Flow Direction: SINK;

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

5

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G32

11 mm

1

32

125 Cel

-40 Cel

SINK

3.9 A

PLASTIC/EPOXY

HSOP

SSOP32,.4

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

2.45 mm

8 mA

18 V

7 V

14 V

YES

GULL WING

.65 mm

DUAL

80 us

80 us

7.5 mm

MC10XS4200DFK by NXP Semiconductors

MC10XS4200DFK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: HQCCN; Package Shape: SQUARE; Length: 12 mm;

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

2

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

S-PQCC-N23

12 mm

3

1

23

125 Cel

-40 Cel

SINK

8.5 A

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

2.2 mm

8.5 mA

36 V

8 V

24 V

YES

NO LEAD

QUAD

40

245 us

245 us

12 mm

MC10XS4200BDFK by NXP Semiconductors

MC10XS4200BDFK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: HQCCN; Package Shape: SQUARE; Driver No. of Bits: 2;

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

2

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

S-PQCC-N23

12 mm

3

1

23

125 Cel

-40 Cel

SINK

8.5 A

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

2.2 mm

8.5 mA

36 V

8 V

24 V

YES

NO LEAD

QUAD

40

245 us

245 us

12 mm

MC10XS4200CFK by NXP Semiconductors

MC10XS4200CFK

NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: NO LEAD; No. of Terminals: 23; Package Code: HQCCN; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

2

STANDARD

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

S-PQCC-N23

12 mm

3

1

23

125 Cel

-40 Cel

SINK

8.5 A

PLASTIC/EPOXY

HQCCN

SQUARE

CHIP CARRIER, HEAT SINK/SLUG

260

2.2 mm

8.5 mA

36 V

8 V

24 V

YES

NO LEAD

QUAD

40

245 us

245 us

12 mm

MC33XS2410EL by NXP Semiconductors

MC33XS2410EL

NXP Semiconductors

MC33XS2410EL by NXP Semiconductors is a peripheral driver with 28 terminals, operating voltage range of 3-5.5V, and built-in protections against transient, over current, and over voltage. It is ideal for automotive applications due to AEC-Q100 screening level and compact rectangular package style.

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; SHORTCIRCUIT; OVERLOAD

4

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G28

9.7 mm

3

1

28

125 Cel

-40 Cel

SINK

PLASTIC/EPOXY

HTSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

260

AEC-Q100

1.1 mm

10 mA

5.5 V

4.5 V

5 V

60 V

3 V

28 V

YES

GULL WING

.65 mm

DUAL

40

58 us

58 us

4.4 mm

MC33XS2410ELR2 by NXP Semiconductors

MC33XS2410ELR2

NXP Semiconductors

MC33XS2410ELR2 by NXP Semiconductors is a peripheral driver with 28 terminals, operating voltage range of 3-5.5V, and built-in protections against transient events. It is designed for applications requiring a buffer or inverter-based peripheral driver with sink output current flow direction, suitable for automotive environments due to AEC-Q100 screening level compliance.

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; SHORTCIRCUIT; OVERLOAD

4

BUFFER OR INVERTER BASED PERIPHERAL DRIVER

R-PDSO-G28

9.7 mm

3

1

28

125 Cel

-40 Cel

SINK

PLASTIC/EPOXY

HTSSOP

TSSOP28,.25

RECTANGULAR

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

260

AEC-Q100

1.1 mm

10 mA

5.5 V

4.5 V

5 V

60 V

3 V

28 V

YES

GULL WING

.65 mm

DUAL

40

58 us

58 us

4.4 mm