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MC33XS2410ELR2

NXP Semiconductors

MC33XS2410ELR2 by NXP Semiconductors

MC33XS2410ELR2 by NXP Semiconductors is a peripheral driver with 28 terminals, operating voltage range of 3-5.5V, and built-in protections against transient events. It is designed for applications requiring a buffer or inverter-based peripheral driver with sink output current flow direction, suitable for automotive environments due to AEC-Q100 screening level compliance.

Median Price

$5.836

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,455 parts In-Stock

1+ parts

$6.314

100+ parts

$5.836

1k+ parts

$5.670

10k+ parts

-

2,455

$6.314

$5.836

$5.670

-

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.280

2,500

-

-

-

$4.280

Verical

USA . 2,455 parts In-Stock

1+ parts

-

100+ parts

$5.836

1k+ parts

$5.670

10k+ parts

-

2,455

-

$5.836

$5.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 87 parts In-Stock

1+ parts

$9.770

100+ parts

-

1k+ parts

-

10k+ parts

-

87

$9.770

-

-

-

Vyrian

USA . 3,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,980

-

-

-

-

Digiode

USA . 1,717 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,717

-

-

-

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Anansix

USA . 1,132 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,132

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,444 parts In-Stock

1+ parts

$3.640

100+ parts

-

1k+ parts

-

10k+ parts

-

2,444

$3.640

-

-

-

AZTECH Wire

Italy . 902 parts In-Stock

1+ parts

$11.770

100+ parts

-

1k+ parts

-

10k+ parts

-

902

$11.770

-

-

-

Microchip USA

USA . 3,800 parts In-Stock

1+ parts

$25.078

100+ parts

-

1k+ parts

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10k+ parts

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3,800

$25.078

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-

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UNI Independent Distributors

Spain . 5,750 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,750

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-

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Corphita

USA . 773 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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773

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-

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Overview

Elevate your electronics with the MC33XS2410ELR2 by NXP Semiconductors, a top-tier manufacturer of cutting-edge semiconductor solutions. Designed for peripheral drivers, this product offers state-of-the-art built-in protections for transient events, overcurrent, overvoltage, thermal issues, short circuits, and overload conditions. With a wide supply voltage range and high operating temperature, this versatile component is ideal for various applications. Experience quality, reliability, and unmatched performance with the MC33XS2410ELR2 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and lightweight, making the peripheral driver easy to handle and install.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; SHORTCIRCUIT; OVERLOAD

The multiple built-in protections ensure the safe operation of the peripheral driver and protect connected devices from damage.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of devices and power sources.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic devices, making this peripheral driver versatile and widely compatible.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and stability even in harsh environmental conditions.

Technical Specifications

Peripheral Drivers MC33XS2410ELR2 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; SHORTCIRCUIT; OVERLOAD

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G28

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

10 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

60 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

28 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

58 us

Turn-on Time:

58 us

Width:

4.4 mm

Trade Compliance

MC33XS2410ELR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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