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MC33298DW

NXP Semiconductors

MC33298DW by NXP Semiconductors

MC33298DW by NXP Semiconductors is a peripheral driver with 8 functions, built-in protections for over current, over voltage, thermal, and Zener clamp. It operates at supply voltages of 4.5V to 16V and has a max output current of 1A. Ideal for automotive applications due to its small outline package style and sink output current flow direction.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,936 parts In-Stock

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Vyrian

USA . 1,375 parts In-Stock

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Anansix

USA . 825 parts In-Stock

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825

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Nova Conductors

Japan . 77 parts In-Stock

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Semi Source

USA . 2 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 251 parts In-Stock

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$11.808

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$11.808

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One Stop Electronics

USA . 1,604 parts In-Stock

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$13.500

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Ampacity Inc.

Singapore . 1,380 parts In-Stock

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$14.500

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$14.500

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AZTECH Wire

Italy . 474 parts In-Stock

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$18.257

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UNI Independent Distributors

Spain . 7,762 parts In-Stock

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Argo Parts USA

USA . 3,024 parts In-Stock

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Perfect Parts

USA . 1,348 parts In-Stock

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Corphita

USA . 1,144 parts In-Stock

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Continental Prestige Electronics

USA . 473 parts In-Stock

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473

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your automotive electronic applications with the MC33298DW peripheral driver by NXP Semiconductors. With built-in protections against over current, over voltage, thermal issues, and a Zener clamp, this compact device ensures reliable performance in challenging environments. Its advanced technology and high-quality materials make it a dependable choice for various automotive systems. Experience seamless operation and peace of mind knowing that your electronics are safeguarded with the MC33298DW. Upgrade your designs today with this versatile and efficient peripheral driver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the peripheral driver.

Maximum Supply Voltage: 5.5 V

Operates efficiently within a safe voltage range, ensuring reliability.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; THERMAL; ZENER CLAMP

Enhanced safety features protect the driver and connected components from damage.

Maximum Output Current: 1 A

Capable of delivering sufficient current for various peripherals.

Nominal Supply Voltage: 5 V

Compatible with standard voltage requirements in many applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ideal for automotive and industrial environments.

Technical Specifications

Peripheral Drivers MC33298DW attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; ZENER CLAMP

Driver No. of Bits:

8

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

Length:

15.4 mm

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

1 A

Nominal Output Peak Current Limit:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,9/16

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

16 V

Minimum Supply Voltage-1:

9 V

Surface Mount:

YES

Technology:

BCD

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

15 us

Turn-on Time:

15 us

Width:

7.5 mm

Trade Compliance

MC33298DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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