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MC33879TEKR2

NXP Semiconductors

MC33879TEKR2 by NXP Semiconductors

MC33879TEKR2 by NXP Semiconductors is a peripheral driver with 32 terminals, operating voltage of 3.1-5.5V, and built-in protections against various faults. It is designed for automotive applications, featuring MOS technology, open-drain output characteristics, and a compact rectangular package style ideal for space-constrained environments.

Median Price

$5.490

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 102 parts In-Stock

1+ parts

$5.490

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102

$5.490

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Chip Stock

USA . 11,500 parts In-Stock

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11,500

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Vyrian

USA . 6,093 parts In-Stock

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6,093

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Digiode

USA . 1,997 parts In-Stock

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1,997

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Anansix

USA . 1,550 parts In-Stock

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1,550

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LIBRA Elektronik GmbH

Germany . 265 parts In-Stock

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265

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$3.872

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174

$3.872

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Continental Prestige Electronics

USA . 8,183 parts In-Stock

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$5.490

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$5.380

8,183

$5.490

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$5.380

Semicontronic

India . 327 parts In-Stock

1+ parts

$8.500

100+ parts

$8.288

1k+ parts

$8.245

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327

$8.500

$8.288

$8.245

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Microchip USA

USA . 2,317 parts In-Stock

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$9.414

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AZTECH Wire

Italy . 1,224 parts In-Stock

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$12.051

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One Stop Electronics

USA . 2,405 parts In-Stock

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$34.500

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2,405

$34.500

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Ampacity Inc.

Singapore . 1,789 parts In-Stock

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$48.500

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1,789

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Lixinc

USA . 15,476 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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Argo Parts USA

USA . 3,998 parts In-Stock

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Corphita

USA . 2,540 parts In-Stock

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2,540

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UNI Independent Distributors

Spain . 1,686 parts In-Stock

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1,686

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Netroflash

USA . 600 parts In-Stock

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100+ parts

$5.380

1k+ parts

$5.215

10k+ parts

$5.106

600

-

$5.380

$5.215

$5.106

Overview

Discover the unparalleled reliability and performance of the MC33879TEKR2 by NXP Semiconductors, a leading manufacturer in the industry. This peripheral driver offers built-in protections for transient, over current, over voltage, thermal, and under voltage situations, ensuring your devices are safeguarded at all times. With a wide range of applications in automotive technology, this product provides exceptional value and benefits to customers looking for a high-quality solution. Experience peace of mind and superior functionality with the MC33879TEKR2 from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for applications where weight and durability are important factors.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

The built-in protections ensure the safety and reliability of the product by safeguarding against various electrical faults and conditions, making it a secure choice for powering peripherals.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can handle demanding environments and extended periods of use without overheating or performance degradation.

Technology: MOS

Using MOS technology ensures efficient operation and low power consumption, making this product energy-efficient and suitable for battery-powered devices.

Nominal Output Peak Current Limit: 1.2 A

The high output peak current limit allows this peripheral driver to power devices that require a significant amount of current, making it versatile and capable of handling a wide range of applications.

Technical Specifications

Peripheral Drivers MC33879TEKR2 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

8

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

1.2 A

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

.7 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.1 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Turn-off Time:

100 us

Turn-on Time:

50 us

Width:

7.5 mm

Trade Compliance

MC33879TEKR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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