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BUK209-50Y,127

NXP Semiconductors

BUK209-50Y,127 by NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 5; Package Code: ZIP; Package Shape: RECTANGULAR;

Median Price

$0.515

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 371 parts In-Stock

1+ parts

-

100+ parts

$0.515

1k+ parts

$0.428

10k+ parts

$0.381

371

-

$0.515

$0.428

$0.381

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 594 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

-

594

$0.206

-

-

-

Vyrian

USA . 7,032 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,032

-

-

-

-

Anansix

USA . 964 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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964

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,462 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

-

3,462

$0.195

-

-

-

AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$13.700

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$13.700

-

-

-

Native Components

USA . 865 parts In-Stock

1+ parts

$14.500

100+ parts

-

1k+ parts

-

10k+ parts

-

865

$14.500

-

-

-

Northwest PG Solutions

USA . 1,121 parts In-Stock

1+ parts

$15.950

100+ parts

$14.355

1k+ parts

-

10k+ parts

-

1,121

$15.950

$14.355

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,136 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,136

-

-

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Microchip USA

USA . 4,584 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,584

-

-

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UNI Independent Distributors

Spain . 4,447 parts In-Stock

1+ parts

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100+ parts

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4,447

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-

Technical Specifications

Peripheral Drivers BUK209-50Y,127 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSFM-T5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

12 A

Nominal Output Peak Current Limit:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP5,.15,.17,67TB

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

5.5/35

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

35 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Turn-off Time:

80 us

Turn-on Time:

70 us

Trade Compliance

BUK209-50Y,127 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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