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BUK205-50X

NXP Semiconductors

BUK205-50X by NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: TO-263; Package Shape: RECTANGULAR; Output Current Flow Direction: SOURCE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,967 parts In-Stock

1+ parts

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4,967

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Vyrian

USA . 453 parts In-Stock

1+ parts

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453

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Anansix

USA . 352 parts In-Stock

1+ parts

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352

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,024 parts In-Stock

1+ parts

$5.500

100+ parts

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1,024

$5.500

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Corphita

USA . 3,815 parts In-Stock

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3,815

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UNI Independent Distributors

Spain . 1,952 parts In-Stock

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1,952

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Northwest PG Solutions

USA . 1,803 parts In-Stock

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1,803

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Native Components

USA . 383 parts In-Stock

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383

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Technical Specifications

Peripheral Drivers BUK205-50X attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G4

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SOURCE

Maximum Output Current:

15 A

Nominal Output Peak Current Limit:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/40

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Trade Compliance

BUK205-50X Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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