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BUK206-50Y

NXP Semiconductors

BUK206-50Y by NXP Semiconductors

BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 4; Package Code: TO-263; Package Shape: RECTANGULAR; Maximum Output Current: 20 A;

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ABC Electronics Ltd.

UK . 4,554 parts In-Stock

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Digiode

USA . 2,649 parts In-Stock

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Anansix

USA . 1,343 parts In-Stock

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Extreme Components

USA . 800 parts In-Stock

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800

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ACDS - Activité Composants Distribution Service

France . 573 parts In-Stock

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Vyrian

USA . 240 parts In-Stock

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240

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Semi Source

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100

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Fibra_Brandt Electronic GMBH

Germany . 40 parts In-Stock

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40

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Distributors (Availability)

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Native Components

USA . 596 parts In-Stock

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$0.298

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$0.286

596

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$0.286

Northwest PG Solutions

USA . 81 parts In-Stock

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$0.328

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$0.289

81

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One Stop Electronics

USA . 141 parts In-Stock

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$12.500

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A-Z Elektronik GmbH

Germany . 4,793 parts In-Stock

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UNI Independent Distributors

Spain . 3,490 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,195 parts In-Stock

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Corphita

USA . 2,226 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Metaverse IC Inc.

Canada . 564 parts In-Stock

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Kepictronics

USA . 464 parts In-Stock

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464

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Technical Specifications

Peripheral Drivers BUK206-50Y attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

JESD-30 Code:

R-PSSO-G4

No. of Functions:

1

No. of Terminals:

4

Output Current Flow Direction:

SOURCE

Maximum Output Current:

20 A

Nominal Output Peak Current Limit:

20 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.6,67TB

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/40

Qualification:

Not Qualified

Maximum Seated Height:

4.5 mm

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

MOS

Terminal Form:

Terminal Pitch:

1.7 mm

Terminal Position:

SINGLE

Trade Compliance

BUK206-50Y Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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