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NX3P1107UKZ

NXP Semiconductors

NX3P1107UKZ by NXP Semiconductors

NX3P1107UKZ from NXP Semiconductors is a robust peripheral driver designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact square package with 4 terminals and supports power supplies of 1.2V/3.3V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

$0.190

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,364 parts In-Stock

1+ parts

$0.184

100+ parts

$0.173

1k+ parts

$0.157

10k+ parts

-

9,364

$0.184

$0.173

$0.157

-

Verical

USA . 6,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.196

6,605

-

-

-

$0.196

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 906 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

-

10k+ parts

-

906

$0.175

-

-

-

Vyrian

USA . 5,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,011

-

-

-

-

Anansix

USA . 1,916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,916

-

-

-

-

Speed Components Ltd

Israel . 90 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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90

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,890 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

3,890

$0.166

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$5.567

100+ parts

$5.066

1k+ parts

$4.565

10k+ parts

-

450

$5.567

$5.066

$4.565

-

Microchip USA

USA . 267 parts In-Stock

1+ parts

$6.870

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$6.870

-

-

-

AZTECH Wire

Italy . 1,108 parts In-Stock

1+ parts

$21.770

100+ parts

-

1k+ parts

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10k+ parts

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1,108

$21.770

-

-

-

Perfect Parts

USA . 14,556 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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14,556

-

-

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UNI Independent Distributors

Spain . 7,760 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,760

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-

-

-

Vigor

Singapore . 448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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448

-

-

-

-

Overview

Unlock the potential of your projects with the NX3P1107UKZ from NXP Semiconductors, a leader in innovative solutions. This robust peripheral driver combines exceptional reliability with superior performance, designed for both industrial and consumer applications. With its compact square package and advanced thermal management, it ensures smooth operation even in challenging environments. Experience enhanced efficiency and durability that drives your designs forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the product's resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier assembly, which can save space on the PCB and improve performance.

Package Shape: SQUARE

The square package shape enables efficient use of board space, allowing for a more organized and compact product design.

Power Supplies (V): 1.2/3.3

Support for multiple voltage supplies makes this product versatile and suitable for a wide range of electronic systems.

No. of Terminals: 4

A limited number of terminals simplifies circuit design and assembly, making integration into existing systems easier and less error-prone.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array design allows for high-density interconnections, which is ideal for compact electronic devices yet ensures robust performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates that this product can function reliably in relatively high thermal environments, enhancing its performance in challenging conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product suitable for industrial applications that may encounter extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates improved thermal performance and space efficiency on PCBs, contributing to better overall product design.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and durability, making this product suitable for demanding industrial applications.

Terminal Form: BALL

Ball terminal form provides excellent electrical conductivity and mechanical stability, ensuring reliable connections and performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density designs, making this product ideal for space-constrained applications while maintaining reliability.

Technical Specifications

Peripheral Drivers NX3P1107UKZ attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Driver No. of Bits:

1

JESD-30 Code:

S-PBGA-B4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Trade Compliance

NX3P1107UKZ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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