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NX3P190UK,023

NXP Semiconductors

NX3P190UK,023 by NXP Semiconductors

NX3P190UK,023 by NXP Semiconductors is a robust peripheral driver designed for industrial applications. It operates within a voltage range of 1.2-3.3V and withstands temperatures from -40 °C to 85 °C. Its compact square package features fine pitch terminals for efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,415

-

-

-

-

Vyrian

USA . 1,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,208

-

-

-

-

Digiode

USA . 597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

597

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,520 parts In-Stock

1+ parts

$40.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,520

$40.500

-

-

-

UNI Independent Distributors

Spain . 2,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,514

-

-

-

-

Corphita

USA . 233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

233

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-

-

-

Overview

Elevate your designs with the NX3P190UK,023 from NXP Semiconductors, a leader in high-quality solutions. This reliable peripheral driver ensures optimal performance across various applications, even in demanding environments. Engineered for durability with a wide temperature range, it enhances efficiency and reduces power consumption. Trust NXP’s expertise to deliver innovative products that drive your projects forward, providing unmatched value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic devices, enhancing overall performance.

Package Shape: SQUARE

A square package shape offers efficient space utilization on the PCB, allowing for high-density designs.

Power Supplies (V): 1.2/3.3

The dual voltage supply compatibility (1.2V and 3.3V) provides flexibility in design and makes it compatible with various systems.

No. of Terminals: 4

Having four terminals facilitates versatile connectivity options for different applications, enhancing functionality.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array style allows for high pin count in a compact layout, optimizing performance in smaller devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this component can function reliably in various industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme cold conditions, making it suitable for harsh environments.

Terminal Position: BOTTOM

Bottom terminal positioning enables efficient space management on the PCB, supporting surface-mount applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades signifies that this component can withstand rigorous operating conditions.

Terminal Form: BALL

Ball terminals provide a secure and reliable electrical connection, enhancing the product's overall performance.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for densely packed PCB layouts, catering to the needs of modern compact electronic devices.

Technical Specifications

Peripheral Drivers NX3P190UK,023 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

Driver No. of Bits:

1

JESD-30 Code:

S-PBGA-B4

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA4,2X2,16

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2/3.3

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Trade Compliance

NX3P190UK,023 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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