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UBA2024P/N1,112

NXP Semiconductors

UBA2024P/N1,112 by NXP Semiconductors

HALF BRIDGE BASED PERIPHERAL DRIVER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.222

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 335,266 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$0.996

10k+ parts

$0.888

335,266

-

$1.200

$0.996

$0.888

Verical

USA . 315,323 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.245

10k+ parts

$1.110

315,323

-

-

$1.245

$1.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 941 parts In-Stock

1+ parts

$0.932

100+ parts

-

1k+ parts

-

10k+ parts

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941

$0.932

-

-

-

Chip Stock

USA . 166,000 parts In-Stock

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166,000

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-

-

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Vyrian

USA . 4,771 parts In-Stock

1+ parts

-

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4,771

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-

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Anansix

USA . 929 parts In-Stock

1+ parts

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100+ parts

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929

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,417 parts In-Stock

1+ parts

$0.883

100+ parts

-

1k+ parts

-

10k+ parts

-

1,417

$0.883

-

-

-

Microchip USA

USA . 103 parts In-Stock

1+ parts

$3.152

100+ parts

-

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-

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103

$3.152

-

-

-

AZTECH Wire

Italy . 485 parts In-Stock

1+ parts

$8.120

100+ parts

-

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10k+ parts

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485

$8.120

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 29,148 parts In-Stock

1+ parts

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29,148

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UNI Independent Distributors

Spain . 7,583 parts In-Stock

1+ parts

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7,583

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A-Z Elektronik GmbH

Germany . 6,434 parts In-Stock

1+ parts

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6,434

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Assy Fe

Spain . 1,500 parts In-Stock

1+ parts

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1,500

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Metaverse IC Inc.

Canada . 650 parts In-Stock

1+ parts

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650

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Kepictronics

USA . 550 parts In-Stock

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550

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Perfect Parts

USA . 11 parts In-Stock

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11

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Technical Specifications

Peripheral Drivers UBA2024P/N1,112 attributes and parameters. Explore more Peripheral Drivers devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e4

Length:

9.5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Nominal Output Peak Current Limit:

.22 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage:

13.3 V

Minimum Supply Voltage:

11.7 V

Nominal Supply Voltage:

12.5 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

UBA2024P/N1,112 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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