Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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GTL2005PW,112
NXP Semiconductors
The NXP Semiconductors GTL2005PW,112 is a small outline interface IC with 4 functions and 14 terminals. It operates b/w -40 to 85°C, with a supply voltage range of 3-3.6V. Ideal for industrial applications requiring reliable signal interfacing in compact spaces.
INTERFACE CIRCUIT
R-PDSO-G14
e4
5 mm
1
4
14
85 Cel
-40 Cel
PLASTIC/EPOXY
TSSOP
TSSOP14,.25
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
260
3.3
Not Qualified
1.1 mm
Other Interface ICs
3.6 V
3 V
3.3 V
YES
INDUSTRIAL
Nickel/Palladium/Gold (Ni/Pd/Au)
GULL WING
.65 mm
DUAL
30
4.4 mm
GTL2005PW,118
NXP Semiconductors' GTL2005PW,118 is a small outline interface IC with 4 functions and 14 terminals. Operating at industrial temperature grades, it supports supply voltages from 3V to 3.6V. Ideal for applications requiring thin profile components in surface mount packages.
NICKEL PALLADIUM GOLD
GTL2010PW,112
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G24
7.8 mm
10
24
2.64 V
2.36 V
2.5 V
GTL2010PW,118
GTL2010PW,118 by NXP Semiconductors is a 24-terminal interface IC with a supply voltage range of 2.36V to 3.6V. It features 10 functions and operates in industrial temperatures from -40°C to 85°C. This thin-profile, surface-mount IC is ideal for various applications requiring reliable signal interfacing at small form factors.
GTL2014PW,112
GTL2014PW,112 by NXP Semiconductors is a 14-terminal interface IC with a supply voltage range of 3V to 3.6V. It features a small outline package style and operates in industrial temperature grades (-40°C to 85°C). Ideal for applications requiring reliable signal interfacing in compact electronic devices.
GTL2018PW,112
TSSOP24,.25
GTL2034PW,112
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: TSSOP; Package Shape: RECTANGULAR;
PCA9306D,112
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G8
4.9 mm
2
8
SOP
SOP8,.25
SMALL OUTLINE
1.75 mm
1 V
1.27 mm
3.9 mm
PCA9306DC,125
PCA9306DC,125 by NXP Semiconductors is an 8-terminal IC with a supply voltage range of 1.1V to 5.5V and operating temperature from -40°C to 85°C. It features a small outline package style suitable for industrial applications requiring interface circuit functionality in compact designs.
2.3 mm
VSSOP
TSSOP8,.12,20
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
1 mm
1.1 V
1.8 V
5.5 V
2.3 V
.5 mm
2 mm
PCA9306DC1,125
PCA9306DC1,125 by NXP Semiconductors is an interface IC with 8 terminals and a supply voltage range of 1.1V to 5.5V. It operates in industrial temperatures (-40°C to 85°C) and has a small outline package style for applications requiring level shifting or bus buffering in various electronic devices.
PCA9507D,112
PCA9507D,112 by NXP Semiconductors is an 8-terminal IC with a supply voltage range of 2.7V to 5.5V and max current of 5mA. It operates in industrial temperatures (-40°C to 85°C) and is ideal for interface circuit applications due to its small outline package and dual terminal position.
3/5
5 mA
2.7 V
PCA9508D,112
Line Driver or Receivers
.9 V
CMOS
PCA9509D,112
PCA9509D,112 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 3-5.5V. It operates in industrial temperatures (-40 to 85°C) and has a compact square package style (4.9mm x 3.9mm). Ideal for applications requiring small outline surface-mount ICs with dual terminals.
S-PDSO-G8
SQUARE
3/3.3
5 V
PCA9510AD,112
6 mA
PCA9510D,112
PCA9511D,112
PCA9512AD,112
PCA9512AD,112 by NXP Semiconductors is a small outline interface IC with 8 terminals. It operates at a supply voltage range of 2.7V to 5.5V and has a max seated height of 1.75mm. This IC is commonly used as a bus buffer in industrial applications.
BUS BUFFERS
3.6 mA
PCA9512D,112
40
PCA9513AD,112
PCA9513D,112
PCA9514AD,112
PCA9514AD,112 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 2.7V to 5.5V and max current of 6mA. It operates in industrial temperatures (-40°C to 85°C) and has a compact rectangular package suitable for surface mount applications. Ideal for various electronic devices requiring signal level translation or buffering functionalities.
PCA9514D,112
PCA9516D,112
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G16
9.9 mm
16
BICMOS
PCA9516PW,112
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
PCA9517AD,112
PCA9517AD,112 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 0.9V to 5.5V, suitable for industrial applications. It features a compact rectangular package style and operates in temperatures ranging from -40°C to 85°C. The device supports CMOS technology and offers dual terminal positions for enhanced connectivity.
1.2 V
PCA9518AD,112
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G20
12.8 mm
20
2.65 mm
7.5 mm
PCA9519PW,112
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
6.5 mm
TSSOP20,.25
1/4,3.3/5
PCA9574PW,112
PCA9701D,112
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
15.4 mm
125 Cel
AUTOMOTIVE
PCA9701PW,112
PCA9701PW,112 by NXP Semiconductors is a 24-terminal IC with supply voltage range of 2.5V to 5.5V. It operates in temperatures from -40°C to 125°C, making it suitable for automotive applications. The package style is small outline, thin profile, shrink pitch, with terminal finish of Ni/Pd/Au for robust performance.
PCA9702PW,112
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
SA5778D,512
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G28
17.9 mm
3
28
105 Cel
SOP28,.4
8/16
Peripheral Drivers
16 V
8 V
SA5778D,518
NVT2001GM,115
INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3; Terminal Finish: Tin (Sn); Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
e3
Tin (Sn)
NVT2002GD,125
NXP Semiconductors' NVT2002GD,125 is an 8-terminal IC with a max supply voltage of 5.5V and operates in industrial temperature range (-40 to 85°C). It's a surface-mount interface circuit with a small outline package suitable for various applications requiring precise signal interfacing.
SEATED HGT-NOM
R-PDSO-N8
3 mm
VSON
SOLCC8,.12,20
SMALL OUTLINE, VERY THIN PROFILE
5.4 V
0 V
NO LEAD
PCA9525D,118
PCA9515ATP,147
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR;
ALSO OPERATES AT 3 V TO 3.6 V
HVSON
SOLCC8,.11,20
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
2.5/3.3
.8 mm
PCA9601DP,118
PCA9601DP,118 by NXP Semiconductors is a small outline interface IC with 8 terminals. It operates b/w -40 to 85 °C and supports supply voltage from 2.5V to 15V. Ideal for bus buffering applications, it features a gull wing terminal form and measures 3x3mm in size.
TSSOP8,.19
15 V
NVT4857UKZ
NXP Semiconductors' NVT4857UKZ is a 20-terminal interface IC with a supply voltage range of 2.9V to 3.6V, suitable for industrial applications. It features a very thin profile package style and operates b/w -40°C to 85°C. The IC is designed for surface mount assembly and has a rectangular shape with a grid array package body material made of plastic/epoxy.
R-PBGA-B20
2.1 mm
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.53 mm
2.9 V
BALL
.4 mm
BOTTOM
1.7 mm
MC33SA0528ACR2
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
S-PQFP-G32
7 mm
32
LQFP
FLATPACK, LOW PROFILE
250
1.6 mm
5.25 V
4.8 V
QUAD
MC33SA0528AC
TIN
MC33SB0400ESR2
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HQCCN; Package Shape: SQUARE;
S-XQCC-N48
48
UNSPECIFIED
HQCCN
CHIP CARRIER, HEAT SINK/SLUG
4.75 V
MOS
MC33SB0400ES
UJA1169TK/FZ
UJA1169TK/FZ by NXP Semiconductors is a small outline, heat sink interface IC with 20 terminals. It operates b/w 2.8V to 28V and meets AEC-Q100 standards for automotive applications. With a terminal pitch of 0.5mm, it is ideal for use in automotive electronic systems requiring reliable performance in harsh environments.
R-PDSO-N20
5.5 mm
AEC-Q100
28 V
2.8 V
13 V
NICKEL PALLADIUM GOLD SILVER
3.5 mm
UJA1169TK/F/3Z
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30;
UJA1169TK/X/FZ
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Peak Reflow Temperature (C): 260;
UJA1169TK/XZ
INTERFACE CIRCUIT; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Peak Reflow Temperature (C): 260;
MC33CD1020AES
INTERFACE CIRCUIT; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
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