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PCA9509D,112

NXP Semiconductors

PCA9509D,112 by NXP Semiconductors

PCA9509D,112 by NXP Semiconductors is an 8-terminal interface IC with a supply voltage range of 3-5.5V. It operates in industrial temperatures (-40 to 85°C) and has a compact square package style (4.9mm x 3.9mm). Ideal for applications requiring small outline surface-mount ICs with dual terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,752 parts In-Stock

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8,752

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Digiode

USA . 4,019 parts In-Stock

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4,019

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Anansix

USA . 2,068 parts In-Stock

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2,068

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Nova Conductors

Japan . 96 parts In-Stock

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96

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Distributors (Availability)

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Microchip USA

USA . 370 parts In-Stock

1+ parts

$1.075

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370

$1.075

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One Stop Electronics

USA . 573 parts In-Stock

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$2.500

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573

$2.500

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AZTECH Wire

Italy . 803 parts In-Stock

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$8.231

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803

$8.231

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Ampacity Inc.

Singapore . 195 parts In-Stock

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$36.500

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195

$36.500

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Corphita

USA . 4,346 parts In-Stock

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UNI Independent Distributors

Spain . 292 parts In-Stock

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Bastille Electronics

Australia . 67 parts In-Stock

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Overview

Enhance your electronic devices with the PCA9509D,112 by NXP Semiconductors, a top-tier manufacturer known for reliability and innovation. This versatile interface IC is perfect for a wide range of applications, offering seamless connectivity and control. With a robust package body material and high-quality components, this product ensures long-lasting performance. Elevate your projects with the PCA9509D,112 and experience the superior value, efficiency, and convenience it brings to your designs. Upgrade your creations today with NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is commonly used for electronic components as it provides good electrical insulation and corrosion resistance.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and space-saving design.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages which provides flexibility in design and compatibility with various systems.

Package Shape: SQUARE

Square package shape allows for easy placement and alignment on the PCB.

Power Supplies (V): 3/3.3

Supports multiple power supply options, making it versatile for different applications.

No. of Terminals: 8

Sufficient number of terminals for connectivity and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltages, providing energy efficiency and compatibility with low-power systems.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, ensuring reliability in harsh environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in PCB layout and connection options.

Maximum Seated Height: 1.75 mm

Low seated height contributes to a compact overall design.

Width: 3.9 mm

Narrow width saves space on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring proper assembly and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and assembly during manufacturing.

Length: 4.9 mm

Compact length saves space on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and performance in harsh operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and strong mechanical connection.

Nominal Supply Voltage: 5 V

Supports a common nominal supply voltage, ensuring compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and assembly.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, providing optimized functionality in those scenarios.

Technical Specifications

Other Function Interface ICs PCA9509D,112 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

PCA9509D,112 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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