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PCA9512AD,112

NXP Semiconductors

PCA9512AD,112 by NXP Semiconductors

PCA9512AD,112 by NXP Semiconductors is a small outline interface IC with 8 terminals. It operates at a supply voltage range of 2.7V to 5.5V and has a max seated height of 1.75mm. This IC is commonly used as a bus buffer in industrial applications.

Median Price

$1.533

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 11 parts In-Stock

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$1.615

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Avnet

USA . 94 parts In-Stock

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Rochester

USA . 8 parts In-Stock

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$1.450

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$1.200

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$1.070

8

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$1.450

$1.200

$1.070

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Digiode

USA . 4,016 parts In-Stock

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$1.130

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Nova Conductors

Japan . 500 parts In-Stock

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$1.327

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Vyrian

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Anansix

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Rebound Electronics

UK . 500 parts In-Stock

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Flip Electronics

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Ampacity Inc.

Singapore . 10 parts In-Stock

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$1.010

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Corphita

USA . 3,885 parts In-Stock

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$1.071

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Vigor

Singapore . 1,176 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$1.327

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$1.300

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Microchip USA

USA . 155 parts In-Stock

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$1.692

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AZTECH Wire

Italy . 458 parts In-Stock

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$11.096

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Aztec Data Supply Inc.

USA . 2,746 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,084 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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UNI Independent Distributors

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Argo Parts USA

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Overview

Discover the PCA9512AD,112 by NXP Semiconductors, a top-quality interface IC that opens up endless possibilities for your projects. With NXP's renowned reputation for excellence, you can trust in the reliability and performance of this product. Perfect for various applications, this bus buffer offers unbeatable value, benefits, and advantages to customers like you. Enhance your designs with ease, thanks to its compact size and easy surface mount installation. Don't miss out on the opportunity to elevate your projects with the PCA9512AD,112!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the integrated circuit, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation, reducing the need for manual soldering and saving valuable time during assembly.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in different operating conditions.

No. of Functions: 1

Despite its compact size, this IC incorporates multiple functions, which offers enhanced functionality and efficiency.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient use of board space, making it suitable for designs where size is a constraint.

Maximum Supply Voltage-1: 5.5 V

Along with the main supply voltage, the secondary supply voltage of 5.5 V allows for optimal performance in complex circuits or systems.

Power Supplies (V): 3/5

This IC supports both 3V and 5V power supplies, ensuring compatibility with various power sources and making it versatile for different applications.

No. of Terminals: 8

With 8 terminals, this IC offers multiple connection points for efficient signal transfer and connectivity within a circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for high-density mounting, enabling more components to be placed on a circuit board, resulting in compact and space-saving designs.

Minimum Supply Voltage-1: 2.7 V

This IC can operate with a minimum supply voltage of 2.7 V, providing power savings and suitable for low-power applications.

Minimum Supply Voltage: 2.7 V

The minimum supply voltage of 2.7 V allows for efficient operation even in systems with limited power supply capabilities.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature rating of 85°C, this product can withstand high-temperature environments, increasing its suitability for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this IC suitable for use in extreme conditions or outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish of nickel, palladium, and gold provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

With dual terminal positions, this IC offers flexibility in terms of circuit board layout, enabling optimal signal routing in various designs.

Maximum Seated Height: 1.75 mm

The low seated height of 1.75 mm allows for compact device designs, particularly useful when space constraints are a concern.

Width: 3.9 mm

The narrow width of this IC facilitates efficient utilization of board space, enabling compact designs and high-density circuitry.

Maximum Time At Peak Reflow Temperature (s): 30

This specification indicates the time the IC can withstand peak reflow temperatures, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and component reliability during manufacturing processes.

Length: 4.9 mm

The small length of this IC allows for space-saving designs and increased flexibility in product integration.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand harsh operating conditions, making it a dependable choice in demanding environments.

Terminal Form: GULL WING

The gull-wing terminal form simplifies surface mounting, providing secure and reliable connections while facilitating efficient manufacturing processes.

Maximum Supply Current: 3.6 mA

With a maximum supply current of 3.6 mA, this IC offers efficient power consumption, making it suitable for low-power devices and preserving battery life.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V ensures stable and consistent power delivery, contributing to the overall reliability and performance of the product.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting, enabling the IC to be used in compact electronic designs.

Nominal Supply Voltage-1: 3.3 V

The additional nominal supply voltage of 3.3 V provides redundancy and backup capability, ensuring uninterrupted operation in case of power supply variations.

Moisture Sensitivity Level (MSL): 1

With an MSL rating of 1, this IC has a low susceptibility to moisture-related issues, ensuring long-term reliability in humid environments.

Interface IC Type: BUS BUFFERS

As a bus buffer, this IC enhances signal integrity and facilitates efficient data transmission, making it an ideal choice for applications involving bus communication protocols.

Technical Specifications

Other Function Interface ICs PCA9512AD,112 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

3.6 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

2.7 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

PCA9512AD,112 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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