Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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INTERFACE CIRCUIT; Terminal Finish: TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
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$5.260
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Other Function Interface ICs MC33CD1020AES attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors
Interface IC Type:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Peak Reflow Temperature (C):
Terminal Finish:
Maximum Time At Peak Reflow Temperature (s):
MC33CD1020AES Interface ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
2N2222A
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
MBRS360T3G
MBRS360T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.63V and a max output current of 3A. It is designed for applications requiring high-speed switching and low power loss, making it suitable for use in various electronic devices.
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
LM2931AZ-5.0G
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LM358MX
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
ISO7720DWV
ISO7720DWV by Texas Instruments is a dual-function interface IC with 2 channels. It operates b/w -55 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it suitable for military-grade applications requiring high reliability in harsh environments. The package style is small outline with gull wing terminals, ideal for surface mount assembly in compact electronic devices.
XISO6720QDWVRQ1
XISO6720QDWVRQ1 by Texas Instruments is an interface IC with 2 functions, operating at a voltage range of 1.71V to 5.5V. It is designed for automotive applications, meeting AEC-Q100 standards, with a compact rectangular package style and dual terminal position. This CMOS technology device has a temperature range from -40°C to 125°C, making it suitable for harsh environments in automotive electronics.
SI8660BA-B-IS1R
Skyworks Solutions
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage: 2.375 V;
ISO7740DWR
ISO7740DWR by Texas Instruments is a 4-channel interface IC with CMOS technology. It operates b/w -55 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it suitable for military-grade applications requiring small outline packages in harsh environments. The package material is plastic/epoxy with nickel/palladium/gold terminal finish, ideal for surface mount assembly with a dual-terminal position.
ADUM2401BRWZ-RL
Analog Devices
ADUM2401BRWZ-RL by Analog Devices is a CMOS interface IC with 16 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 2.7V to 5.5V and terminal pitch of 1.27mm. Ideal for industrial applications requiring small outline package style and dual terminal position.
MAX12931BASA+T
MAX12931BASA+T by Analog Devices is a digital isolator with 8 terminals, operating from -40 to 125°C. It has a supply voltage range of 1.71V to 5.5V and uses BICMOS technology. This small outline IC is ideal for applications requiring surface mount packages in various electronic devices.
DS2484Q+T
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR;
253
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; No. of Terminals: 22; Nominal Supply Voltage: 5 V; Nominal Negative Supply Voltage: -5 V; Package Equivalence Code: FL22,.4;
SI8662BB-B-IU
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16;
ISO1640BQDRQ1
ISO1640BQDRQ1 by Texas Instruments is an automotive interface IC with 2 channels. It operates at a supply voltage range of 2.25V to 5.5V and has a temperature range of -40°C to 125°C. It is suitable for various automotive applications requiring small outline packaging and high reliability (AEC-Q100 screening level).
SI8641AB-B-IS1
Silicon Labs
SI8641AB-B-IS1 by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.5V to 5.5V, and temperature range from -40°C to 125°C. It is used in applications requiring small outline package style and surface mount technology for interface functions.
ISOUSB211DPR
ISOUSB211DPR by Texas Instruments is a small outline interface IC with 28 terminals. It operates b/w -40 to 125°C and has a supply voltage range of 1.71-1.94V. Ideal for applications requiring dual terminal positions and surface mount compatibility.
ADUM1311BRWZ-RL
ADUM1311BRWZ-RL by Analog Devices is a CMOS interface IC with 16 terminals, operating b/w -40 to 105°C. It has a supply voltage range of 2.7V to 5.5V and is suitable for industrial applications requiring small outline surface-mount packages.
MAX12931BASA+
DIGITAL ISOLATOR; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
ADUM1400CRWZ
ADUM1400CRWZ by Analog Devices is a 16-terminal IC with 4 functions, operating b/w -40 to 105°C. It supports EIA-232, EIA-422, and EIA-485 interfaces at supply voltages ranging from 2.7V to 5.5V. Ideal for industrial applications requiring small outline packages and dual terminal positions.
ISO7021FDR
ISO7021FDR by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 1.71V to 5.5V, it comes in a small outline package ideal for surface mount assembly.
MAX253ESA/V
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
PM8533B-F3EI
Microsemi
INTERFACE CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; No. of Functions: 1; Package Style (Meter): SPECIAL SHAPE;
MAX4896ETP+
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE;
SI8663BC-B-IS1R
SI8663BC-B-IS1R by Silicon Labs is a digital isolator with 16 terminals, operating voltage range of 2.375V to 5.5V, and AEC-Q100 screening for automotive applications. It features CMOS technology, dual terminal position, and small outline package style suitable for high-temperature environments up to 125°C.
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MC33CD1030AER2
INTERFACE CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: HLFQFP; Package Shape: SQUARE; Length: 7 mm;
MC33972ATEWR2
INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
Freescale Semiconductor
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: Matte Tin (Sn);
MC33972ATEKR2
INTERFACE CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
INTERFACE CIRCUIT; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
MC33978AEKR2
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SSOP; Package Shape: RECTANGULAR;
MC33797BPEW
MC33797BPEW by NXP Semiconductors is a 32-terminal interface IC with a supply voltage of 5V. It operates in industrial temperature range (-40 to 85°C) and features Gull Wing terminals for surface mounting. This IC is designed for applications requiring small outline, shrink pitch package style.
INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: Matte Tin (Sn);
MC33972ATEW
INTERFACE CIRCUIT; JESD-609 Code: e3; Terminal Finish: Matte Tin (Sn); Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
INTERFACE CIRCUIT; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
MC33972TEW
MC33884DWR2
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
MC33972TEWR2
MC33972ATEK
INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3;
MC33975AEK
MC33789AE
INTERFACE CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
MC33975AEKR2
MC33797BPEWR2
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SSOP; Package Shape: RECTANGULAR;
MC33972ATEKR2,518
INTERFACE CIRCUIT; Package Shape: RECTANGULAR; No. of Functions: 1; Package Body Material: UNSPECIFIED;
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