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TFBGA Other Function Interface ICs 10

Other Function Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Built-in Protections Maximum Delay Display Mode Driver No. of Bits Interface IC Type Interface Standard JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Backplanes No. of Bits No. of Channels No. of Digits/Characters No. of Functions No. of Segments No. of Terminals Maximum Operating Temperature Minimum Operating Temperature Output Characteristics Maximum Output Current Output Latch/Register Nominal Output Peak Current Limit Output Polarity Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Maximum Receive Delay Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Maximum Supply Voltage-1 Minimum Supply Voltage-1 Nominal Supply Voltage-1 Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Turn-off Time Turn-on Time Width
ST6G3237TBR by STMicroelectronics

ST6G3237TBR

STMicroelectronics

ST6G3237TBR by STMicroelectronics is a 25-terminal interface IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.4V to 3.6V. Designed for industrial applications, it features a thin profile grid array package suitable for surface mount assembly.

INTERFACE CIRCUIT

S-PBGA-B25

3 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.16 mm

3.6 V

1.4 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

3 mm

ST6G3238ETBR by STMicroelectronics

ST6G3238ETBR

STMicroelectronics

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: TFBGA; Package Shape: SQUARE;

INTERFACE CIRCUIT

S-XBGA-B25

e1

3 mm

3

1

25

85 Cel

-40 Cel

UNSPECIFIED

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

Not Qualified

1.16 mm

3.6 V

1.4 V

3 V

YES

CMOS

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

3 mm

ST6G3238BETBR by STMicroelectronics

ST6G3238BETBR

STMicroelectronics

ST6G3238BETBR by STMicroelectronics is a 25-terminal interface IC with CMOS technology. It operates b/w -40 to 85 °C, with supply voltage range of 1.4V to 3.6V. Ideal for industrial applications requiring thin profile and fine pitch grid array package style.

INTERFACE CIRCUIT

S-PBGA-B25

e4

3 mm

3

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

Not Qualified

1.16 mm

3.6 V

1.4 V

3 V

YES

CMOS

INDUSTRIAL

NICKEL GOLD

BALL

.5 mm

BOTTOM

30

3 mm

ST6G3237BTBR by STMicroelectronics

ST6G3237BTBR

STMicroelectronics

ST6G3237BTBR from STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a compact 25-terminal grid array package. Ideal for space-constrained environments, it ensures reliable performance in harsh conditions.

INTERFACE CIRCUIT

S-PBGA-B25

3 mm

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.16 mm

3.6 V

1.4 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

3 mm

ST6G3240TBR by STMicroelectronics

ST6G3240TBR

STMicroelectronics

ST6G3240TBR from STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w 1.4V and 3.6V, with a max temp of 85 °C and features a compact 36-terminal grid array package. Ideal for space-constrained environments, it ensures reliable performance in demanding conditions.

INTERFACE CIRCUIT

S-PBGA-B36

3.6 mm

1

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

Not Qualified

1.16 mm

3.6 V

1.4 V

1.8 V

YES

CMOS

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

3.6 mm

DS250DF210ABMT by Texas Instruments

DS250DF210ABMT

Texas Instruments

DS250DF210ABMT by Texas Instruments is a 2-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and features surface mount capability. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

2

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

DS250DF410ABMR by Texas Instruments

DS250DF410ABMR

Texas Instruments

DS250DF410ABMR by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) and has bottom terminal position with tin silver copper finish. Ideal for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

DS250DF410ABMT by Texas Instruments

DS250DF410ABMT

Texas Instruments

DS250DF410ABMT by Texas Instruments is a 4-channel interface IC with a package style of grid array, thin profile, and fine pitch. It operates in industrial temperature range (-40 to 85°C) with peak reflow temperature of 260°C. Suitable for applications requiring high-speed data transmission in compact electronic devices.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

4

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm

TDA8026ET/C3K by NXP Semiconductors

TDA8026ET/C3K

NXP Semiconductors

INTERFACE CIRCUIT; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA64,8X8,32;

INTERFACE CIRCUIT

S-PBGA-B64

7 mm

2

1

64

85 Cel

-25 Cel

PLASTIC/EPOXY

TFBGA

BGA64,8X8,32

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

5.5 V

2.7 V

3.3 V

YES

BALL

.8 mm

BOTTOM

7 mm

DS250DF210ABMR by Texas Instruments

DS250DF210ABMR

Texas Instruments

DS250DF210ABMR by Texas Instruments is a 2-channel interface IC with a temperature range of -40 to 85°C. It features a grid array package style, 0.5mm terminal pitch, and TSC terminal finish. Ideal for industrial applications requiring high-speed data transmission in compact spaces.

INTERFACE CIRCUIT

S-PBGA-B101

e1

6 mm

3

2

1

101

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.03 mm

YES

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

6 mm