Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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MF1PLUS8001DA4/03
NXP Semiconductors
MF1PLUS8001DA4/03 by NXP Semiconductors is a consumer circuit IC designed for surface mount applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form in a microelectronic assembly package. Ideal for various electronic devices, it ensures reliable performance in diverse environments.
CONSUMER CIRCUIT
X-PXMA-N
1
70 Cel
-25 Cel
PLASTIC/EPOXY
UNSPECIFIED
MICROELECTRONIC ASSEMBLY
Not Qualified
YES
OTHER
NO LEAD
MF1PLUS8001DUD/03
MF1PLUS8001DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, features an unencased chip package, and has no lead terminals. Ideal for compact electronic devices requiring reliable performance.
X-XUUC-N
DIE
UNCASED CHIP
UPPER
MF1PLUS8031DA4/03
MF1PLUS8031DA4/03 by NXP Semiconductors is a surface-mount consumer IC designed for microelectronic applications. It operates b/w -25 °C and 70 °C, featuring a no-lead terminal form in a plastic/epoxy package. Ideal for various consumer electronics, it ensures reliable performance in diverse environments.
MF1PLUS8031DUD/03
MF1PLUS8031DUD/03 by NXP Semiconductors is a surface mount consumer IC designed for various applications. It operates b/w -25 °C and 70 °C, featuring an unencased chip design with no lead terminals. Ideal for compact electronic devices, it ensures reliable performance in diverse environments.
MF1SPLUS6001DA4/03
CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Surface Mount: YES; Package Style (Meter): MICROELECTRONIC ASSEMBLY; JESD-30 Code: X-PXMA-N;
MF1SPLUS6001DUD/03
CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; Terminal Position: UPPER; Surface Mount: YES;
MF1SPLUS6031DA4/03
IP4786CZ32,118
IP4786CZ32,118 by NXP Semiconductors is a consumer circuit IC with 32 terminals in a square chip carrier package. It operates b/w -25 to 85 °C and supports power supplies of 1.8/5,5 V. Ideal for applications requiring a very thin profile and surface mount compatibility.
SEATED HGT-NOM
S-PQCC-N32
5 mm
32
85 Cel
HVQCCN
LCC32,.2SQ,20
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
1.8/5,5
.85 mm
Other Consumer ICs
6.5 V
4.5 V
.5 mm
QUAD
30
TDA9981BHL/15/C1;5
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G80
12 mm
80
0 Cel
LFQFP
QFP80,.55SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
1.8,3.3
1.6 mm
200 mA
1.95 V
1.65 V
GULL WING
TDA9981BHL/8/C1,51
e3
2
107.5 mA
TIN
CX24109-11Z,518
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TFQFP; Package Shape: SQUARE;
S-PQFP-G48
7 mm
3
48
TFQFP
TQFP48,.35SQ
FLATPACK, THIN PROFILE, FINE PITCH
5
1.2 mm
262 mA
5.25 V
4.75 V
COMMERCIAL
CX24109-11Z,557
IP4778CZ38,118
CONSUMER CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 38; Package Code: TSSOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V;
ALSO REQUIRES SUPPLY FROM 4.5 TO 5.5
R-PDSO-G38
e4
9.7 mm
38
TSSOP
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
5.5 V
2.7 V
NICKEL PALLADIUM GOLD
DUAL
4.4 mm
PTN3300AHF,518
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N48
-40 Cel
.8 mm
3.6 V
3 V
INDUSTRIAL
PTN3300AHF2,518
PTN3300BHF,518
S-XQCC-N48
40
PTN3300BHF2,518
Nickel/Palladium/Gold (Ni/Pd/Au)
PTN3700EV/G,118
PTN3700EV/G,118 by NXP Semiconductors is a consumer IC with 56 terminals in a rectangular grid array package. It operates b/w -40 to 85°C and has a very thin profile of 1mm. Suitable for industrial applications, it requires a supply voltage b/w 1.65V to 1.95V and features ball terminals with 0.5mm pitch.
R-PBGA-B56
4.5 mm
56
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
1 mm
BALL
BOTTOM
4 mm
SAA1305T/N1,112
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G24
15.4 mm
24
SOP
SMALL OUTLINE
2.65 mm
1.27 mm
7.5 mm
SAA1305T/N1,118
SAA6581T/V1,512
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G16
10.3 mm
16
4 V
CMOS
SAA6581T/V1,518
SAA6752HS/V103,557
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
S-PQFP-G208
28 mm
208
FQFP
FLATPACK, FINE PITCH
4.1 mm
2.3 V
SAA6752HS/V104,557
SAA7109AE/V1/G,518
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 156; Package Code: LBGA; Package Shape: SQUARE;
S-PBGA-B156
15 mm
156
LBGA
GRID ARRAY, LOW PROFILE
1.65 mm
3.45 V
3.15 V
SAA7109AE/V1/G,557
SAA7109E/V1,518
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 156; Package Code: BGA; Package Shape: SQUARE;
IT ALSO REQUIRES 3V TO 3.6V SUPPLY
BGA
GRID ARRAY
1.75 mm
TDA19977BHV/15/C1
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
IT ALSO REQUIRES 3.3V SUPPLY
S-PQFP-G144
20 mm
144
QFP144,.87SQ,20
1.89 V
1.71 V
TDA3629/N2,112
CONSUMER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.2 mm;
R-PDIP-T8
9.5 mm
8
DIP
IN-LINE
4.2 mm
NO
THROUGH-HOLE
2.54 mm
7.62 mm
TDA3629T/N2,112
CONSUMER CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G16;
TDA3629T/N2,118
CONSUMER CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
TDA8020HL/C1,118
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
S-PQFP-G32
-30 Cel
LQFP
FLATPACK, LOW PROFILE
TDA8020HL/C2,118
NXP Semiconductors' TDA8020HL/C2,118 is a consumer IC with 32 terminals in a square flatpack package. It operates b/w -40°C to 85°C, with supply voltage ranging from 2.7V to 6.5V. Ideal for industrial applications requiring low profile and surface mount capabilities.
TDA8588BJ/N3,112
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 37; Package Shape: RECTANGULAR; Surface Mount: NO;
R-PZFM-T37
37
FLANGE MOUNT
18 V
8 V
BCDMOS
ZIG-ZAG
TDA8588J/N3,112
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 37; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
TDA8589AJ/N3,112
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 37; Package Shape: RECTANGULAR; JESD-30 Code: R-PZFM-T37;
TDA8589BJ/N3,112
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 37; Package Shape: RECTANGULAR; Technology: BCDMOS;
TDA8589J/N1,112
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 37; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TDA9875AH/V2,557
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
S-PQFP-G64
14 mm
64
-20 Cel
QFP
FLATPACK
3 mm
TDA9889TS/V1,512
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
6.2 mm
SSOP
SMALL OUTLINE, SHRINK PITCH
2 mm
.65 mm
5.3 mm
TDA9889TS/V1,518
TDA9955HL/17/C1:55
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
IT ALSO REQUIRES 3.15V TO 3.45V SUPPLY
S-PQFP-G100
100
1.85 V
1.75 V
TDA9965AHL/C3,118
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
75 Cel
COMMERCIAL EXTENDED
TDA9983BHW/15/C1:5
CONSUMER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: TFQFP; Package Shape: SQUARE;
TQFP80,.55SQ
TDA9983BHW/8/C1,51
TDA9983BHW/8/C1,55
TEA6101T/N3,112
CONSUMER CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
R-PDSO-G20
12.8 mm
20
TEA6880H/V2,557
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;
R-PQFP-G64
3.2 mm
9.2 V
7.8 V
BIPOLAR
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