Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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UDA1342TS/N1,512
NXP Semiconductors
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
CONSUMER CIRCUIT
R-PDSO-G28
e4
10.2 mm
1
28
85 Cel
-40 Cel
PLASTIC/EPOXY
SSOP
SSOP28,.3
RECTANGULAR
SMALL OUTLINE, SHRINK PITCH
3
Not Qualified
2 mm
Other Consumer ICs
3.6 V
2.7 V
YES
INDUSTRIAL
NICKEL PALLADIUM GOLD
GULL WING
.65 mm
DUAL
5.3 mm
UDA1342TS/N1,518
UDA1380TT/N2,512
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G32
11 mm
2
32
TSSOP
TSSOP32,.3
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
2.4 V
6.1 mm
PTN3460IBS/F1Z
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 56; Package Code: HVQCCN; Package Shape: SQUARE;
ALSO REQUIRES 3.0 TO 3.6
S-PQCC-N56
7 mm
56
HVQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
1 mm
1.9 V
1.7 V
NO LEAD
.4 mm
QUAD
PTN3460IBS/F2Z
TDA8037TT/C1J
CONSUMER CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
30
NT2L1011G0DUDZ
CONSUMER CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): NOT SPECIFIED;
R-XUUC-N4
4
70 Cel
-25 Cel
UNSPECIFIED
DIE
UNCASED CHIP
NOT SPECIFIED
UPPER
MF1S7000XDA4,118
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 4; Package Shape: RECTANGULAR; No. of Functions: 1;
R-XXMA-N4
MICROELECTRONIC ASSEMBLY
OTHER
Silver (Ag)
MF1S7031XDUD,005
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;
CGD982HCI,112
CONSUMER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 7; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Terminal Position: SINGLE;
R-XSFM-T7
7
FLANGE MOUNT
NO
HYBRID
THROUGH-HOLE
SINGLE
CGD985HCI,112
CONSUMER CIRCUIT; Terminal Form: UNSPECIFIED; No. of Terminals: 9; Package Shape: UNSPECIFIED; Package Style (Meter): SPECIAL SHAPE; Terminal Position: UNSPECIFIED;
X-XXSS-X9
9
SPECIAL SHAPE
CGD985HCI/01,112
CONSUMER CIRCUIT; Terminal Form: UNSPECIFIED; No. of Terminals: 9; Package Shape: UNSPECIFIED; Surface Mount: NO; Package Style (Meter): SPECIAL SHAPE;
OM7650,112
CONSUMER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 5; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Package Body Material: UNSPECIFIED;
R-XSMA-T5
5
TDA3629/Y,112
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
R-PDIP-T8
9.5 mm
8
105 Cel
DIP
IN-LINE
4.2 mm
18 V
8 V
2.54 mm
7.62 mm
TDA3629/YWU
TDA3629T/YM,112
NXP Semiconductors TDA3629T/YM,112 is a 16-terminal IC with operating temperature range of -40 to 105°C. It is a consumer circuit in small outline package suitable for industrial applications. Features include supply voltage range of 8-18V and compact dimensions of 9.9mm x 3.9mm x 1.75mm, making it ideal for various electronic devices.
R-PDSO-G16
9.9 mm
16
SOP
SMALL OUTLINE
1.75 mm
1.27 mm
3.9 mm
TDA3629T/YM,118
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TDA3629T/YM/WJ
NICKEL PALLADIUM GOLD SILVER
PTN3360BBS,518
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N48
48
3 V
.5 mm
PTN3360DBS/S900,51
SLRC40001T/OFE,112
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR;
20.5 mm
250
2.65 mm
5.5 V
4.5 V
7.5 mm
TDA8020HL/C2,151
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
S-PQFP-G32
LQFP
FLATPACK, LOW PROFILE
1.6 mm
6.5 V
2.5 V
.8 mm
TDA8025HN/C1,518
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N32
5 mm
TDA8025HN/C1,551
TDA8025HN/C1,557
TDA8034AT/C1,112
NXP Semiconductors' TDA8034AT/C1,112 is a small outline consumer IC with 16 terminals. It operates b/w -25°C to 85°C and requires a supply voltage of 2.7V to 3.6V. Ideal for applications in consumer circuits requiring compact design and surface mount compatibility.
IT ALSO REQURIES A 4.85V TO 5.5V SUPPLY
TDA8034HN/C1,151
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N24
4 mm
24
TDA8034HN/C1,157
TDA8034T/C1,112
TDA8034T/C1,112 by NXP Semiconductors is a small outline consumer IC with 16 terminals. It operates b/w -25°C to 85°C and has a supply voltage range of 2.7V to 3.6V. This rectangular package is surface mountable and suitable for various consumer circuit applications.
UDA1352TS/N3,112
IT ALSO REQUIRES A 2.4V TO 3.6V DIGITAL SUPPLY
UDA1352TS/N3,118
UDA1355H/N2,518
NXP Semiconductors UDA1355H/N2,518 is a 44-terminal consumer circuit IC with operating temperature range of -40 to 85°C. It features a supply voltage range of 2.7V to 3.6V and comes in a square flatpack package style. Ideal for industrial applications requiring compact design and surface mount capability.
S-PQFP-G44
10 mm
44
QFP
FLATPACK
2.1 mm
UDA1355H/N2,557
NXP Semiconductors UDA1355H/N2,557 is a 44-terminal consumer IC with operating temperature range of -40 to 85°C. It features a supply voltage range of 2.7V to 3.6V and Gull Wing terminal form. This square-shaped flatpack IC is ideal for industrial applications requiring compact design and high performance.
PTN3356R1BSZ
SEATED HEIGHT CONSIDERED NOMINAL
S-PQCC-N32
0 Cel
.85 mm
2.8 V
PTN3361CBSMP
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CBTV24DD12ETY
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR;
R-PBGA-B48
8 mm
-10 Cel
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.05 mm
3.63 V
1.62 V
BALL
BOTTOM
3 mm
PTN36001HXAZ
CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: RECTANGULAR;
R-PQCC-N12
12
VQCCN
CHIP CARRIER, VERY THIN PROFILE
1.25 mm
PTN36241GHXAZ
CONSUMER CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 12; Package Code: VQCCN; Package Shape: RECTANGULAR;
PTN36043BXY
The NXP Semiconductors PTN36043BXY is a consumer IC with 18 terminals in a chip carrier package. It operates b/w -40°C to 85°C, making it suitable for industrial applications. With surface mount capability and no-lead terminal form, it offers high reliability in various electronic devices.
R-PQCC-N18
18
QCCN
CHIP CARRIER
PTN3356BS/F2MP
CONSUMER CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 3;
NT2H1001G0DUDV
CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel; No. of Functions: 1;
R-XUUC-N
NT2H1001G0DUFV
CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Surface Mount: YES; Maximum Operating Temperature: 70 Cel;
NT2L1001G0DUDV
CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel; Package Style (Meter): UNCASED CHIP;
NT2L1001G0DUFV
CONSUMER CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: RECTANGULAR; JESD-30 Code: R-XUUC-N; Minimum Operating Temperature: -25 Cel;
TDA8034HN/C2EL
CONSUMER CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1;
TDA8034HN/C2J
CONSUMER CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
TDA8034HN/C2QL
CONSUMER CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1;
TDA8037T/C1S
CONSUMER CIRCUIT; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; Peak Reflow Temperature (C): 260; JESD-609 Code: e4;
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