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CBTV24DD12ETY

NXP Semiconductors

CBTV24DD12ETY by NXP Semiconductors

CONSUMER CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR;

Median Price

$2.520

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 33,771 parts In-Stock

1+ parts

-

100+ parts

$2.520

1k+ parts

$2.250

10k+ parts

$2.120

33,771

-

$2.520

$2.250

$2.120

Avnet

USA . 18,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.838

18,000

-

-

-

$1.838

Verical

USA . 13,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.813

10k+ parts

$2.650

13,500

-

-

$2.813

$2.650

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,843 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

-

4,843

$2.670

-

-

-

Vyrian

USA . 8,073 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,073

-

-

-

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Anansix

USA . 1,232 parts In-Stock

1+ parts

-

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1,232

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-

-

-

SPM Sales

USA . 83 parts In-Stock

1+ parts

-

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83

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 499 parts In-Stock

1+ parts

$0.386

100+ parts

-

1k+ parts

-

10k+ parts

$0.371

499

$0.386

-

-

$0.371

Northwest PG Solutions

USA . 484 parts In-Stock

1+ parts

$0.425

100+ parts

-

1k+ parts

-

10k+ parts

$0.374

484

$0.425

-

-

$0.374

Corphita

USA . 1,627 parts In-Stock

1+ parts

$2.529

100+ parts

-

1k+ parts

-

10k+ parts

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1,627

$2.529

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.739

100+ parts

$2.712

1k+ parts

$2.602

10k+ parts

-

3,000

$2.739

$2.712

$2.602

-

AZTECH Wire

Italy . 1,179 parts In-Stock

1+ parts

$8.590

100+ parts

-

1k+ parts

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10k+ parts

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1,179

$8.590

-

-

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Microchip USA

USA . 393 parts In-Stock

1+ parts

$13.480

100+ parts

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10k+ parts

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393

$13.480

-

-

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UNI Independent Distributors

Spain . 7,992 parts In-Stock

1+ parts

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100+ parts

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7,992

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Technical Specifications

Other Function Consumer ICs CBTV24DD12ETY attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PBGA-B48

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.05 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

1.62 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

3 mm

Trade Compliance

CBTV24DD12ETY General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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