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CBTV24DD12AETY

NXP Semiconductors

CBTV24DD12AETY by NXP Semiconductors

Other Consumer ICs; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

Median Price

$1.920

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 13,500 parts In-Stock

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-

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$1.920

13,500

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$1.920

Distributors (In-Stock)

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Vyrian

USA . 4,994 parts In-Stock

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4,994

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Digiode

USA . 3,641 parts In-Stock

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3,641

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Anansix

USA . 1,891 parts In-Stock

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1,891

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 642 parts In-Stock

1+ parts

$5.593

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642

$5.593

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One Stop Electronics

USA . 1,286 parts In-Stock

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$15.800

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1,286

$15.800

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Microchip USA

USA . 7,954 parts In-Stock

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7,954

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Corphita

USA . 3,539 parts In-Stock

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3,539

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Northwest PG Solutions

USA . 2,299 parts In-Stock

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$5.481

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2,299

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$5.481

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UNI Independent Distributors

Spain . 1,244 parts In-Stock

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1,244

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Technical Specifications

Other Function Consumer ICs CBTV24DD12AETY attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Trade Compliance

CBTV24DD12AETY General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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