Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE;
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Field Programmable Gate Arrays (FPGA) XCV1000E-7BG560C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
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Power Supplies:
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Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
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Length:
Width:
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JESD-30 Code:
JESD-609 Code:
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XCV1000E-7BG560C Programmable ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SMBJ18CA
Concord Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
1N4148WS
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
1N4148
Microsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Gulf Semiconductor
LL4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Shenzhen Yixinsemi Electronics
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
OPA2227UA
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
OPA2277UA/2K5E4
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
Baneasa S A
10M50SAE144I7G
Intel
The Intel 10M50SAE144I7G is a FPGA with 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. Ideal for industrial applications requiring high performance in a compact package with a max supply voltage of 3.15 V and operating temperature range from -40 to 100 °C.
10M02SCM153C8G
Altera
The Altera 10M02SCM153C8G is a Field Programmable Gate Array (FPGA) with a package body made of plastic/epoxy. It is surface mountable and has a square shape with a ball form of terminal. The package code is BGA and it has 153 terminals. This FPGA operates between temperatures of 0 to 85 degrees Celsius. Its JESD-30 Code is S-PBGA-B153. The maximum time at peak reflow temperature and peak reflow temperature are not specified. The grading of temperature is other.
EP4CE30F23C8N
The EP4CE30F23C8N by Altera is a field programmable gate array with 28848 logic cells, 331 inputs and outputs, and a maximum clock frequency of 472.5 MHz. It is suitable for various applications including digital signal processing, high-speed communications, and industrial automation.
EP4CE6F17C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
XC7A35T-2FGG484I
Xilinx
Xilinx XC7A35T-2FGG484I FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring fast processing speeds and programmable ICs in a compact square grid array package with 484 terminals.
10M50DAF484C8G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M02SCE144C8GES
FIELD PROGRAMMABLE GATE ARRAY;
XC6SLX45-3CSG324I
Xilinx XC6SLX45-3CSG324I FPGA features 43661 logic cells, 3411 CLBs, and 218 inputs/outputs. With a max clock frequency of 862 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. Operating temperature ranges from -40 to 100°C, making it suitable for various environments.
M2S090-FCSG325I
Microchip Technology
Microchip Technology's M2S090-FCSG325I FPGA features 86184 logic cells, 180 inputs/outputs, and operates at a max supply voltage of 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors.
LCMXO3LF-9400C-6BG256C
Lattice Semiconductor
LCMXO3LF-9400C-6BG256C by Lattice Semiconductor is a 1175 CLBs FPGA with max supply voltage of 3.465V and operating temp up to 85°C. Ideal for applications requiring low profile, fine pitch grid arrays in plastic/epoxy packages.
XC7K325T-2FFG676I
Xilinx XC7K325T-2FFG676I is a FPGA with 326080 logic cells, 25475 CLBs, and max clock frequency of 1818 MHz. It's used in industrial applications requiring high-speed processing and programmable ICs for versatile functionality.
LIFCL-40-7BG256C
LIFCL-40-7BG256C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It features 9750 CLBs, 74 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-performance computing in compact spaces.
A3P1000-PQG208M
A3P1000-PQG208M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. It operates at a max clock frequency of 350 MHz, making it suitable for military-grade applications requiring high-speed processing in harsh environments. With a package style of flatpack and fine pitch, this FPGA is ideal for compact electronic systems that demand efficient performance.
ICE40HX4K-CB132
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 132; Package Code: FBGA; Package Shape: SQUARE;
LFXP2-8E-5TN144C
LFXP2-8E-5TN144C by Lattice Semiconductor is a 1.2V FPGA with 8000 logic cells, 1000 CLBs, and 100 inputs/outputs. It operates at up to 435MHz clock frequency and can withstand temperatures from 0 to 85°C. Ideal for applications requiring high-speed processing in compact designs.
XC3SD1800A-4CSG484C
The Xilinx XC3SD1800A-4CSG484C FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at a max clock frequency of 250 MHz and is suitable for applications requiring high-speed processing and programmable ICs in commercial extended temperature environments.
EP4CE15F17C7N
M1AGL600V2-FGG144I
M1AGL600V2-FGG144I by Microchip Technology is a CMOS FPGA with 13824 logic cells and 600000 equivalent gates. It operates b/w -40 to 100°C, has a supply voltage range of 1.14-1.575 V, and features a grid array package style. Ideal for industrial applications requiring high gate count and low profile packaging in compact spaces.
M2GL025-FGG484
EP1C3T144I7N
EP1C3T144I7N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells and 291 CLBs. It operates at a max clock frequency of 320 MHz, making it suitable for industrial applications requiring high-speed processing. With a package style of flatpack and low profile, this FPGA offers versatility in design while maintaining a compact form factor.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCV100-4CS144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
XCV100-4PQ240I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 240; Package Code: FQFP; Package Shape: SQUARE; JESD-609 Code: e0;
XCV1000-6BGG560C
XCV1000-4FG680C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE;
XCV1000-5BGG560C
XCV1000-6BG560C
XCV1000-5BG560C
XCV1000-6BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Nominal Supply Voltage (V): 2.5;
XCV1000-4BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; No. of Equivalent Gates: 1124022;
XCV1000-5BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE;
XCV1000-4FG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .8 ns;
XCV1000-5FG680C
XCV1000-5FGG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Maximum Clock Frequency: 294 MHz;
XCV1000-4FGG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; Finishing Of Terminal Used: Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5);
XCV1000-6BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCV1000-4BGG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Length: 42.5 mm;
XCV1000-5FG680I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 680; Package Code: LBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B680;
XCV1000-5BG560I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 560; Package Code: LBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCV1000-4BG560C
XCV1000-4BGG560C
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