Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Xilinx XCS20-3TQG144I FPGA features 400 CLBs, 7000 gates, and a max clock frequency of 125 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs. Package style: Flatpack, low profile, fine pitch with matte tin finishing.
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Using plastic/epoxy as the package body material makes this FPGA lightweight and durable, ideal for portable applications.
With surface mount capability, this FPGA can be easily mounted onto circuit boards, saving space and simplifying the assembly process.
A high maximum supply voltage of 5.5 V allows for flexibility in power supply options and compatibility with a wide range of systems.
With 400 Configurable Logic Blocks, this FPGA offers a high level of customization and versatility for complex logic designs.
Utilizing CMOS technology ensures low power consumption and high noise immunity, making this FPGA energy-efficient and reliable.
The square package shape provides a compact footprint, maximizing space efficiency in circuit board layouts.
The gull wing form of terminal offers reliable connections and easy soldering, ensuring robust and secure device integration.
With 7000 equivalent gates, this FPGA can handle large logic circuits and complex processing tasks with ease.
The nominal supply voltage of 5 V is a common standard in many electronic systems, ensuring easy integration and compatibility.
With 144 terminals, this FPGA offers ample connectivity options for interfacing with other components and devices.
Being a Field Programmable Gate Array allows for on-the-fly reconfiguration and customization, making this FPGA versatile and adaptable for different applications.
The flatpack, low profile, and fine pitch package style ensures space-saving and efficient design integration in compact electronic devices.
A low minimum supply voltage of 4.5 V enables operation in power-constrained environments while maintaining performance.
With a terminal pitch of 0.5 mm, this FPGA offers high-density packaging for increased functionality in limited space applications.
A low combinatorial delay of 1.6 ns ensures fast signal propagation and processing, making this FPGA suitable for high-speed applications.
The organization of 400 CLBs and 7000 gates provides a balance between logic resources and flexibility, allowing for efficient design implementation.
The use of matte tin finishing on terminals enhances solderability and ensures a reliable electrical connection, improving overall device performance.
The quad position of terminals allows for easy and secure mounting on circuit boards, facilitating smooth production processes and reliable connections.
With a moisture sensitivity level of 3, this FPGA can withstand typical manufacturing and handling processes without risk of damage.
A low seated height of 1.6 mm makes this FPGA suitable for applications with strict height constraints, maximizing board space efficiency.
With a width of 20 mm, this FPGA offers a compact form factor for space-constrained designs while providing ample logic resources and connectivity options.
A high maximum clock frequency of 125 MHz enables fast and efficient data processing and system performance in real-time applications.
The maximum time of 30 seconds at peak reflow temperature allows for reliable soldering and ensures component integrity during manufacturing processes.
With a peak reflow temperature of 260°C, this FPGA can withstand high-temperature soldering processes, ensuring robust assembly and long-term reliability.
The length of 20 mm provides a balanced form factor for this FPGA, offering a combination of compact size and functional capabilities for diverse design requirements.
Field Programmable Gate Arrays (FPGA) XCS20-3TQG144I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCS20-3TQG144I Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
BAV99
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS84-7-F
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
1N4148WS
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
LM2931AZ-5.0RAG
LM2931AZ-5.0RAG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage, 0.1A max output current, and 0.6V max dropout voltage. Ideal for applications requiring stable voltage regulation in temperature-sensitive environments up to 150°C.
Signetics
1N4148
Texas Instruments
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
2N2222A
Crystalonics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
Rfe International
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
STM32H743IIT6
STMicroelectronics
STM32H743IIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications due to its wide temperature range (-40°C to 85°C) and various connectivity options (CAN, I2C, UART, USB).
10M02SCE144C7G
Intel
The Intel 10M02SCE144C7G is a FPGA with 2000 logic cells, 125 CLBs, and 246 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring high-speed data processing and programmable logic capabilities in commercial extended temperature environments.
10M08SAM153I7G
Altera
The Altera 10M08SAM153I7G is a field programmable gate array (FPGA) with a plastic/epoxy package and surface mount capability. It has a square package shape with ball terminals and a package code of BGA. With 153 terminals, it is a versatile programmable IC. It features a grid array package style and bottom terminal position. The JESD-30 code for this FPGA is S-PBGA-B153. Unfortunately, detailed information regarding its maximum time at peak reflow temperature and peak reflow temperature are not specified.
LCMXO3LF-1300C-5BG256C
Lattice Semiconductor
LCMXO3LF-1300C-5BG256C by Lattice Semiconductor is a 160 CLBs FPGA with max supply voltage of 3.465V and min operating temp of 0°C. Ideal for applications requiring low profile, fine pitch grid array packages in electronics industry.
XC6SLX45T-3FGG484C
Xilinx
Xilinx XC6SLX45T-3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 296 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, with a max operating temperature of 85°C. Ideal for projects demanding programmable ICs with advanced CMOS technology.
10M16DAF256A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7A15T-1CSG325I
The Xilinx XC7A15T-1CSG325I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications requiring high-speed processing and programmable ICs for various electronic systems.
EP1C3T144C8N
EP1C3T144C8N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells, 291 CLBs, and a max clock frequency of 275 MHz. It is ideal for applications requiring high-speed processing and customizable logic circuits in compact electronic designs.
LFXP2-8E-5FTN256C
LFXP2-8E-5FTN256C by Lattice Semiconductor is a 8000 logic cell FPGA with 201 inputs/outputs, operating at 435 MHz. It uses CMOS technology, has a max supply voltage of 1.26 V, and is suitable for applications requiring high-speed processing in compact electronic systems.
XC7S50-2FGGA484C
The Xilinx XC7S50-2FGGA484C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing such as telecommunications equipment and industrial automation systems.
EP4CE15F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XC7S50-1FGGA484I
Xilinx XC7S50-1FGGA484I FPGA features 52160 logic cells, 4075 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with a max operating temp of 100°C.
ICE40LP8K-CM81TR
ICE40LP8K-CM81TR by Lattice Semiconductor is a CMOS FPGA with 7680 logic cells, 960 CLBs, and 63 inputs/outputs. It operates at 1.2V with a max combinatorial delay of 9.36ns. Ideal for industrial applications requiring high-speed processing in compact designs due to its fine pitch grid array package style and low operating temperature range of -40 to 100°C.
EP4CE15F17C8N
EP4CE15F17C8N by Intel is a FPGA with 15408 logic cells, 963 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities. With a package style of GRID ARRAY, it offers versatility for various design requirements.
XC7A15T-1CPG236I
Xilinx XC7A15T-1CPG236I is a FPGA with 16640 logic cells, 1300 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. With a package style of grid array and low profile, it offers versatility in various electronic designs.
LFCPNX-100-7BBG484I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
LFE5U-25F-6MG285C
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
XC7A35T-1FTG256C
Xilinx XC7A35T-1FTG256C is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. Package style: Grid Array, low profile, fine pitch.
M2S090-FCS325I
Microchip Technology's M2S090-FCS325I FPGA boasts 86184 logic cells, 180 inputs/outputs, and operates at a supply voltage range of 1.14V to 1.26V. Ideal for applications requiring high-density programmable logic solutions in compact form factors with fine pitch grid arrays.
M2GL005-TQG144I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC7A75T-2FTG256C
Xilinx XC7A75T-2FTG256C FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
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XCS20XL-4CS144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
XCS20-3TQ144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCS20XL-5PQG208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XCS200E-7PQ208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;
XCS20-3TQG144C
XCS20-3VQ100I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCS20-3VQG100C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XCS200E-6FG456I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
XCS200E-6PQ208C
XCS20-3PQ208I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCS200E-7FT256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCS20-3PQG208C
XCS20-3VQ100C
XCS200E-6FT256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCS200E-6PQ208I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;
XCS20-3PQG208I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Width: 28 mm;
XCS20-3PQ208C
XCS200E-6FG456C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
XCS200E-6FT256C
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