Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Xilinx XCS20-3TQ144C FPGA offers 400 logic cells, 7000 gates, and a max clock frequency of 125 MHz. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with GULL WING terminals.
Median Price
$36.250
Lifecycle Status
Suppliers In-Stock
18
In-Stock Inventory
1k+
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1+ parts
100+ parts
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1k+ parts
10k+ parts
American Microsemiconductor Inc.
Vyrian
Chip Stock
Digiode
Nova Conductors
ACDS - Activité Composants Distribution Service
Goldney Electronics S.L.
ComSIT Distribution GmbH
ComSIT USA
Bristol Electronics
Classic Components Corporation
J2 Sourcing AB
Atlantic Semiconductor
Mentor Electronics Marketing, LLC
PC Components Company LLC
Semi Source
Electronics Depot
Semicontronic
$6.000
$5.850
$5.820
AZTECH Wire
$9.462
Ampacity Inc.
$11.000
Modulus Dynamics
$11.594
One Stop Electronics
$18.000
Corohmni
$62.632
Texas Native Microelectronics
$162.564
$143.056
Kenton Components
$195.077
$187.274
$181.421
$171.668
Microchip USA
$420.057
Qasali Group International
$438.923
$408.198
Perfect Parts
A-Z Elektronik GmbH
Authorized Procurement Solutions
MARBEL Systems
S.R.D Solutions
Argo Parts USA
Aranea Global
Continental Prestige Electronics
RC Electronics
Kepictronics
Supply Digital
Vigor
Corphita
Plastic/Epoxy material provides durability and protection to the internal components of the FPGA, ensuring reliable performance in various operating conditions.
Having 400 logic cells allows for a higher level of complexity and functionality to be implemented in the FPGA design, making it suitable for a wide range of applications.
Surface mount technology enables easy and efficient PCB assembly, saving time and effort during the production process.
The high maximum supply voltage of 5.25 V allows for flexibility in power input requirements, accommodating a wider range of voltage sources.
CMOS technology offers low power consumption and high noise immunity, resulting in improved efficiency and reliability of the FPGA.
With 160 inputs, the FPGA can handle a larger amount of data input simultaneously, making it suitable for applications requiring high-speed computing and processing.
The square package shape helps with efficient PCB layout and space utilization, allowing for easy integration into various electronic systems.
Gull wing terminals provide secure and reliable solder connections, enhancing the durability and longevity of the FPGA in operation.
Having 7000 equivalent gates allows for complex logic operations to be implemented in the FPGA, providing versatility and flexibility in design options.
The nominal supply voltage of 5 V is a standard requirement in many electronic systems, ensuring compatibility and ease of integration with existing infrastructure.
Having multiple power supplies at 5 V provides redundancy and stability in the power distribution to the FPGA, reducing the risk of performance issues or failures.
Having 144 terminals allows for easy connectivity and integration with external components, facilitating the overall functionality and performance of the FPGA.
Being a field-programmable gate array enables customization and reconfiguration of the logic functions, offering flexibility and adaptability in various applications.
The flatpack, low profile, and fine pitch package style helps reduce the overall size and weight of the FPGA, making it suitable for compact and space-constrained environments.
The low minimum supply voltage of 4.75 V ensures efficient power consumption and reduces energy costs, making the FPGA more environmentally friendly and cost-effective.
With a high maximum operating temperature of 85°C, the FPGA can withstand harsh environmental conditions and operate reliably in a wide range of temperature settings.
The small pitch of 0.5 mm allows for high-density interconnections and compact PCB designs, enhancing the overall efficiency and performance of the FPGA.
The low maximum combinatorial delay of 1.6 ns ensures fast response times and high-speed processing capabilities, making the FPGA suitable for real-time applications.
The organization of 400 CLBs and 7000 gates provides a balanced ratio of logic elements, allowing for optimized performance and functionality in the FPGA design.
With a low minimum operating temperature of 0°C, the FPGA can start up and operate reliably in cold environments without compromising performance or functionality.
Tin/Lead finishing of terminals ensures excellent solderability and corrosion resistance, enhancing the overall reliability and longevity of the FPGA in operation.
Quad position of terminals provides multiple connection points for easy integration and compatibility with various PCB layouts and designs, increasing the versatility of the FPGA.
A moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, necessitating proper handling and storage to prevent damage to the FPGA during assembly or operation.
The low maximum seated height of 1.6 mm helps reduce the overall profile and size of the FPGA, making it suitable for applications with strict space constraints or height limitations.
With a width of 20 mm, the FPGA can be easily integrated into standard PCB layouts and designs, ensuring compatibility and ease of installation in various electronic systems.
A high maximum clock frequency of 125 MHz allows for fast signal processing and high-speed data transfer, making the FPGA ideal for applications requiring real-time processing and high-performance computing.
Having 160 outputs enables the FPGA to drive multiple external devices or components simultaneously, providing flexibility and scalability in system design and operation.
The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and secure connections during PCB assembly, reducing the risk of solder joint failures or defects.
The peak reflow temperature of 225°C allows for efficient and reliable solder reflow processes during PCB assembly, ensuring high-quality connections and long-term stability of the FPGA.
With a length of 20 mm, the FPGA can be easily accommodated in standard PCB layouts and designs, facilitating seamless integration and compatibility with various electronic systems.
Field Programmable Gate Arrays (FPGA) XCS20-3TQ144C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XCS20-3TQ144C Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
2N2222A
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
Philips Components
1N4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Electronic Devices
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
Unitrode
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
A3P1000-FGG484
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
ICE5LP1K-SG48ITR
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
XC7A50T-2CPG236C
Xilinx
Xilinx XC7A50T-2CPG236C is a FPGA with 52160 logic cells, 4075 CLBs, and max clock frequency of 1286 MHz. It operates b/w -40 to 85 °C and is ideal for high-speed digital applications requiring low power consumption.
LFE5U-25F-6BG381I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
LFCPNX-100-9LFG672C
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4;
XC7A75T-2FTG256C
Xilinx XC7A75T-2FTG256C FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
EP1C3T100I7N
Intel
EP1C3T100I7N by Intel is a FPGA with 2910 logic cells, 291 CLBs, and max clock frequency of 320 MHz. It is used in industrial applications due to its high operating temperature range (-40 to 100 °C) and versatile programmable IC type for various electronic designs. The package style includes flatpack, thin profile, fine pitch making it suitable for compact electronic devices.
10CL120YF484I7G
Intel's 10CL120YF484I7G FPGA features 119088 logic cells, 7443 CLBs, and 277 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style mounting.
A3P1000-PQG208M
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP3C5E144I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
M1AGL600V2-FGG144I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
XC7A35T-1FGG484I
Xilinx XC7A35T-1FGG484I FPGA features 33280 logic cells, 2600 CLBs, and a max clock frequency of 1098 MHz. Ideal for high-performance applications requiring fast processing speeds in compact designs. Package style: grid array, with a square shape and ball terminals for efficient mounting.
M2GL060-FCSG325I
Microchip Technology
M2GL060-FCSG325I by Microchip Technology is a FPGA with 56520 logic cells, 200 inputs/outputs, and operates at -40 to 100°C. It features a grid array package style, 0.5mm terminal pitch, and plastic/epoxy body material. Ideal for applications requiring high-speed data processing and programmable logic functions in various industries.
EP4CE10E22C7N
EP4CE10E22C7N by Intel is a FPGA with 10320 logic cells, 645 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. With a package style including flatpack and low profile options, it offers versatility in design integration.
XCAU20P-1SFVB784E
Xilinx XCAU20P-1SFVB784E is a FPGA with 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. It operates b/w -40°C to 100°C, with supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-performance programmable ICs in compact form factors.
XC7S15-2FTGB196I
The Xilinx XC7S15-2FTGB196I is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in industrial applications requiring high-speed processing and low power consumption. The package style is grid array, low profile, fine pitch with matte tin finishing for optimal performance.
XC7A35T-L1CSG324I
The Xilinx XC7A35T-L1CSG324I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1098 MHz. It is used in industrial applications for high-speed processing tasks due to its low profile package style and fine pitch grid array design.
XC7S6-2FTGB196I
Xilinx XC7S6-2FTGB196I FPGA offers 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption. Package style is grid array, low profile, fine pitch.
A3P1000-PQG208M by Microchip Technology is a CMOS FPGA with 24576 logic cells and 1000000 equivalent gates. It operates at a max clock frequency of 350 MHz, making it suitable for military-grade applications requiring high-speed processing in harsh environments. With a package style of flatpack and fine pitch, this FPGA is ideal for compact electronic systems that demand efficient performance.
EP3C16E144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: RECTANGULAR;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XCS20-3TQG144I
Xilinx XCS20-3TQG144I FPGA features 400 CLBs, 7000 gates, and a max clock frequency of 125 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in compact designs. Package style: Flatpack, low profile, fine pitch with matte tin finishing.
XCS20XL-4CS144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: TFBGA; Package Shape: SQUARE;
XCS20XL-5PQG208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XCS200E-7PQ208C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;
XCS20-3TQG144C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XCS20-3VQ100I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
XCS20-3VQG100C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XCS200E-6FG456I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
XCS200E-6PQ208C
XCS20-3PQ208I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XCS200E-7FT256C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCS20-3PQG208C
XCS20-3VQ100C
XCS200E-6FT256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XCS200E-6PQ208I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: QFP; Package Shape: SQUARE;
XCS20-3PQG208I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE; Width: 28 mm;
XCS20-3PQ208C
XCS200E-6FG456C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 456; Package Code: BGA; Package Shape: SQUARE;
XCS200E-6FT256C
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