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XC7K160T-3FBG484E

Xilinx

XC7K160T-3FBG484E by Xilinx

Xilinx XC7K160T-3FBG484E FPGA features 162240 logic cells, 12675 CLBs, and a max clock frequency of 1412 MHz. Ideal for applications requiring high-speed processing and complex logic functions in a compact form factor.

Median Price

$602.500

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Kenton Components

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Continental Prestige Electronics

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Overview

Unlock endless possibilities with the XC7K160T-3FBG484E by Xilinx, a cutting-edge Field Programmable Gate Array that offers unparalleled quality and performance. Manufactured by Xilinx, a leader in FPGA technology, this versatile device is designed to empower innovation across various applications. With a wide range of features and benefits, including high-speed processing capabilities and low power consumption, this FPGA provides customers with a competitive edge in their projects. Experience the value of flexibility and efficiency with the XC7K160T-3FBG484E, your ultimate solution for advanced digital designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA, making it suitable for various applications.

No. of Logic Cells: 162240

With a high number of logic cells, this FPGA offers flexibility and capability to handle complex designs.

Surface Mount: YES

Being surface mountable makes this FPGA easy to integrate onto PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage helps in minimizing power consumption and heat generation in the system.

No. of CLBs: 12675

The large number of Configurable Logic Blocks (CLBs) allows for versatile logic customization and design implementations.

Technology Used: CMOS

Utilizing CMOS technology ensures efficient power consumption and high speed performance of the FPGA.

No. of Inputs: 285

With a generous number of inputs, this FPGA can handle multiple data streams and inputs efficiently.

Package Shape: SQUARE

The square shape of the package offers easy handling and placement on PCBs, optimizing space utilization.

Form Of Terminal: BALL

Ball terminals provide secure connections and enable easy soldering of the FPGA onto the PCB.

Power Supplies (V): 1,1.8,3.3

Supporting multiple power supply voltages offers compatibility with various system configurations and requirements.

No. of Terminals: 484

The abundance of terminals allows for versatile connectivity options and facilitates system integration.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a programmable FPGA enables customization and reconfigurability for diverse applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient thermal dissipation and robust mechanical support for the FPGA.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures reliable operation even under minimal power conditions.

Pitch Of Terminal: 1 mm

The tight terminal pitch enables high-density packing of components on the PCB, saving valuable board space.

Maximum Combinatorial Delay of a CLB: 0.58 ns

Short combinatorial delay ensures fast signal processing and high-speed performance of the FPGA.

Organization: 12675 CLBS

The organized layout of CLBs simplifies logic design and implementation, enhancing system efficiency.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures corrosion resistance and reliable connections.

Position Of Terminal: BOTTOM

Bottom-positioned terminals facilitate easy PCB mounting and enhance thermal management.

Moisture Sensitivity Level (MSL): 4

With MSL 4, the FPGA can withstand humidity and environmental conditions, ensuring long-term reliability.

Maximum Seated Height: 2.54 mm

The low seated height makes this FPGA suitable for applications where space constraints are critical.

Width: 23 mm

The compact width of the FPGA allows for efficient PCB layout and integration in tight spaces.

Maximum Clock Frequency: 1412 MHz

The high clock frequency capability enables fast data processing and real-time operation of the FPGA.

No. of Outputs: 285

The abundant outputs support efficient data transmission and connectivity in complex systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, the FPGA can withstand high-temperature soldering processes.

Peak Reflow Temperature °C: 250

The high peak reflow temperature tolerance ensures reliability during the soldering process.

Length: 23 mm

The moderate length of the FPGA allows for easy handling and placement on the PCB.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7K160T-3FBG484E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

162240

No. of Inputs:

285

No. of Outputs:

285

No. of CLBs:

12675

Maximum Clock Frequency:

1412 MHz

CLB Maximum Delay:

0.58 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

12675 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Power Supplies:

1,1.8,3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.54 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC7K160T-3FBG484E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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