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XC6SLX45T-4FGG484C

Xilinx

XC6SLX45T-4FGG484C by Xilinx

Xilinx XC6SLX45T-4FGG484C FPGA features 43661 logic cells, 296 inputs/outputs, and operates at 1.2V with a max temp of 85°C. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

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AZTECH Wire

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One Stop Electronics

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Overview

Unlock endless possibilities with the XC6SLX45T-4FGG484C FPGA by Xilinx. Renowned for their cutting-edge technology and superior quality, Xilinx has crafted a product that guarantees exceptional performance and reliability. This FPGA is perfect for a wide range of applications, from aerospace to telecommunications. With 43661 logic cells and 296 inputs/outputs, this FPGA offers unmatched flexibility and customization. Experience seamless integration and faster time-to-market with the XC6SLX45T-4FGG484C FPGA - your gateway to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness.

No. of Logic Cells: 43661

High number of logic cells allows for complex programmable functions and designs.

Surface Mount: YES

Surface mount technology makes it easier to integrate into circuit boards.

Technology Used: CMOS

CMOS technology offers low power consumption and high speed operation.

No. of Inputs: 296

Large number of inputs provides flexibility in connecting to other components.

Package Shape: SQUARE

Square shape can help in efficient use of space on the circuit board.

Form Of Terminal: BALL

Ball terminals offer reliable connection and soldering.

Power Supplies (V): 1.2,2.5/3.3

Multiple power supply options allow for compatibility with different systems.

No. of Terminals: 484

High number of terminals allows for versatile connections.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA technology offers reprogrammable functionality, making it versatile for various applications.

Package Style (Meter): GRID ARRAY

Grid array packaging provides a compact and efficient layout for the product.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliable performance in various environments.

Pitch Of Terminal: 1 mm

Fine pitch terminals allow for tight placement on the circuit board.

Minimum Operating Temperature: 0 °C

Low operating temperature ensures functionality even in cold conditions.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Tin/silver/copper finish offers good conductivity and corrosion resistance for terminals.

Position Of Terminal: BOTTOM

Bottom terminal position helps in efficient heat dissipation.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture.

Maximum Seated Height: 2.6 mm

Low seated height allows for compact design and integration into tight spaces.

Width: 23 mm

Moderate width provides a balance between space efficiency and ease of handling.

No. of Outputs: 296

Large number of outputs enables versatile signal routing and processing capabilities.

Maximum Time At Peak Reflow Temperature (s): 30

Product can withstand peak reflow temperatures for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 250

High peak reflow temperature capability ensures reliable solder joints during assembly.

Length: 23 mm

Moderate length offers a balanced form factor for easy integration into circuit designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45T-4FGG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

296

No. of Outputs:

296

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45T-4FGG484C Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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