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W9751G6NB-25

Winbond Electronics

W9751G6NB-25 by Winbond Electronics

DDR2 DRAM; No. of Terminals: 84; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 120 mA; Self Refresh: YES;

Median Price

$1.720

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,854 parts In-Stock

1+ parts

$1.711

100+ parts

$1.397

1k+ parts

$1.340

10k+ parts

$1.340

1,854

$1.711

$1.397

$1.340

$1.340

DigiKey

USA . 21,177 parts In-Stock

1+ parts

$1.720

100+ parts

$1.516

1k+ parts

$1.400

10k+ parts

$1.400

21,177

$1.720

$1.516

$1.400

$1.400

Mouser Electronics

USA . 1,657 parts In-Stock

1+ parts

$1.720

100+ parts

$1.400

1k+ parts

$1.400

10k+ parts

$1.390

1,657

$1.720

$1.400

$1.400

$1.390

Chip1Stop

Japan . 128 parts In-Stock

1+ parts

$2.300

100+ parts

$1.610

1k+ parts

-

10k+ parts

-

128

$2.300

$1.610

-

-

Verical

USA . 1,854 parts In-Stock

1+ parts

-

100+ parts

$1.397

1k+ parts

$1.340

10k+ parts

$1.340

1,854

-

$1.397

$1.340

$1.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TECHDesign

Taiwan . 5,112 parts In-Stock

1+ parts

$2.100

100+ parts

$1.970

1k+ parts

$1.820

10k+ parts

-

5,112

$2.100

$1.970

$1.820

-

Chip Stock

USA . 188,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

188,900

-

-

-

-

Cyclops Electronics Ltd

UK . 16,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,720

-

-

-

-

Sensible Micro Corp

USA . 6,423 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,423

-

-

-

-

IBS Electronics

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.518

10k+ parts

-

172

-

-

$1.518

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 8,961 parts In-Stock

1+ parts

$2.540

100+ parts

$1.960

1k+ parts

$1.800

10k+ parts

$1.510

8,961

$2.540

$1.960

$1.800

$1.510

Microchip USA

USA . 7,962 parts In-Stock

1+ parts

$17.355

100+ parts

$17.248

1k+ parts

$17.248

10k+ parts

$17.248

7,962

$17.355

$17.248

$17.248

$17.248

RC Electronics

USA . 49,009 parts In-Stock

1+ parts

-

100+ parts

$2.050

1k+ parts

$1.870

10k+ parts

$1.820

49,009

-

$2.050

$1.870

$1.820

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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25,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 12,659 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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12,659

-

-

-

-

iodParts Technologies Inc.

India . 1,295 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,295

-

-

-

-

Perfect Parts

USA . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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22

-

-

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-

Technical Specifications

DRAM W9751G6NB-25 attributes and parameters. Explore more DRAM devices from Winbond Electronics

Specs

Access Mode:

FOUR BANK PAGE BURST

Maximum Access Time:

.4 ns

Additional Features:

AUTO/SELF REFRESH

Maximum Clock Frequency (fCLK):

400 MHz

Input/Output Type:

COMMON

Interleaved Burst Length:

4,8

JESD-30 Code:

R-PBGA-B84

Length:

12.5 mm

Memory Density:

536870912 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

84

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32MX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,9X15,32

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Self Refresh:

YES

Sequential Burst Length:

4,8

Maximum Standby Current:

.008 Amp

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

W9751G6NB-25 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.28

SB

8542.32.00.15

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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