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W25Q32FVTCIG

Winbond Electronics

W25Q32FVTCIG by Winbond Electronics

W25Q32FVTCIG by Winbond Electronics is a NOR flash memory with 32Mx1 organization, operating at 104MHz clock frequency. It features hardware/software write protection and offers 100000 write/erase cycles endurance. Ideal for industrial applications requiring reliable non-volatile memory with SPI serial bus interface.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,063 parts In-Stock

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8,063

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Nova Conductors

Japan . 82 parts In-Stock

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82

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 172 parts In-Stock

1+ parts

$3.186

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172

$3.186

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Aztec Data Supply Inc.

USA . 182 parts In-Stock

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$3.419

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182

$3.419

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AZTECH Wire

Italy . 286 parts In-Stock

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$12.143

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286

$12.143

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Continental Prestige Electronics

USA . 4,495 parts In-Stock

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4,495

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Aranea Global

USA . 500 parts In-Stock

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500

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Argo Parts USA

USA . 193 parts In-Stock

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193

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Overview

Unlock the power of efficient data storage with the Winbond Electronics W25Q32FVTCIG Flash Memory. Manufactured by industry leader Winbond Electronics, this high-quality product offers unparalleled value and benefits for a wide range of applications. With its durable plastic/epoxy body and synchronous operating mode, this flash memory is perfect for industrial-grade projects that require reliable performance and fast data access. Trust Winbond Electronics to deliver cutting-edge technology that meets your needs and exceeds your expectations. Upgrade to the W25Q32FVTCIG Flash Memory today and experience superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage / Vsup (V): 3

Operates efficiently at a standard voltage of 3V, ensuring compatibility with a wide range of devices.

Memory Density: 33554432 bit

High memory density allows for storing a large amount of data in a compact form, essential for applications requiring ample storage capacity.

Endurance: 100000 Write/Erase Cycles

With a high endurance rating, the product is reliable for frequent read/write operations, ensuring longevity and data integrity.

Serial Bus Type: SPI

The serial bus type SPI enables fast and efficient data transfer, making it suitable for applications requiring high-speed communication.

Technical Specifications

Flash Memory W25Q32FVTCIG attributes and parameters. Explore more Flash Memory devices from Winbond Electronics

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

20

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

33554432 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Terminals:

24

No. of Words:

33554432 words

No. of Words Code:

32M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32MX1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,4X6,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/3.3

Programming Voltage (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

20 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Type:

NOR TYPE

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

W25Q32FVTCIG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Winbond Electronics

Winbond was established in September 1987 and listed on Taiwan Stock Exchange in 1995, and is headquartered in Central Taiwan Science Park, Taichung, Taiwan. Winbond's 12-inch fabs, which are the factories with high levels of intelligent technology and automation, are located in Taichung and Kaohsiung Science Park. Winbond is a Specialty memory IC company. From product design, research and development, and wafer fabrication to the marketing of brand name products, Winbond endeavors to provide its global clientele with total memory solutions. Winbond's major product lines include Code Storage Flash Memory, TrustME® Secure Flash,Specialty DRAM and Mobile DRAM. The Company is the only one in Taiwan with the ability to develop DRAM and FLASH products in-house. Our advantages of technological autonomy and prudent capacity strategies enable us to build a highly flexible production system and create synergy among product lines, which allows us to meet the diverse demands of customers while building our brand image. Winbond’s products are used extensively in handheld devices, consumer electronics, and computer peripherals. We also focus on high-barrier, high-quality applications, such automotive and industrial electronics. Winbond has set up operations and distributor networks in the USA, Japan, China, Hong Kong , Israel ,and Germany to serve clients better and expand the depth and breadth of product sales. With regard to quality, Winbond pursues excellence and zero defects, and is certified in a number of quality and environmental safety management systems. It is also the first memory manufacturer in Taiwan to obtain the ISO 26262 certification, which is the highest standard for automotive functional safety. Winbond also always adheres to high standards of corporate governance; we have been evaluated by the Taiwan Stock Exchange as one of the top 20% listed corporate governance. Winbond will continue to provide customer-oriented services. Furthermore, by leveraging the strength of our advanced semiconductor design and manufacturing know-how, observing the core values of "accountability, innovation and synergy" and incorporating the corporate spirit of "execution, innovation and passion" in all operational activities, Winbond will strive towards the goal of becoming a hidden champion in providing sustainable semiconductors technology to enrich human life.

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