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SI7601DN-T1-E3

Vishay Intertechnology

SI7601DN-T1-E3 by Vishay Intertechnology

Vishay Intertechnology's SI7601DN-T1-E3 is a P-CHANNEL FET with 16A max drain current and 52W max power dissipation. Ideal for high-power applications, it operates at up to 150°C, making it suitable for various industrial and automotive electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 430 parts In-Stock

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430

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Nova Conductors

Japan . 400 parts In-Stock

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400

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 82 parts In-Stock

1+ parts

$1.181

100+ parts

$1.075

1k+ parts

$0.968

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82

$1.181

$1.075

$0.968

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AZTECH Wire

Italy . 752 parts In-Stock

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$11.016

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752

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Continental Prestige Electronics

USA . 2,936 parts In-Stock

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2,936

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Argo Parts USA

USA . 936 parts In-Stock

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936

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Aranea Global

USA . 500 parts In-Stock

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500

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Overview

Experience the power of innovation with the SI7601DN-T1-E3 by Vishay Intertechnology. As a leading manufacturer in the industry, Vishay Intertechnology ensures top-notch quality and reliability in their products. The SI7601DN-T1-E3 falls under the category of Power Field Effect Transistors (FET), offering P-CHANNEL polarity and a maximum drain current of 16 A. With a maximum power dissipation of 52 W and operating temperature of 150°C, this FET is ideal for various applications where high performance is key. Trust Vishay Intertechnology to deliver unmatched value and benefits with the SI7601DN-T1-E3.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-state resistance which allows for efficient power handling and higher current carrying capacity.

Configuration: SINGLE

The single configuration simplifies circuit design and allows for easier implementation in various applications.

Surface Mount: YES

Surface mount capability makes the FET suitable for compact and space-constrained designs.

Maximum Drain Current (Abs) (ID): 16 A

With a maximum drain current of 16 A, this FET can handle heavy loads efficiently.

Maximum Power Dissipation (Abs): 52 W

The high maximum power dissipation of 52 W ensures the FET can handle high power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low gate drive power consumption, making it ideal for power management applications.

Maximum Operating Temperature: 150 °C

The FET can operate at temperatures up to 150°C, allowing it to be used in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) SI7601DN-T1-E3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SI7601DN-T1-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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