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SI7601DN-T1-GE3

Vishay Intertechnology

SI7601DN-T1-GE3 by Vishay Intertechnology

Vishay Intertechnology's SI7601DN-T1-GE3 is a P-CHANNEL FET with 16A max drain current and 52W max power dissipation. Ideal for high-power applications, it operates at up to 150°C, making it suitable for various industrial and automotive electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Pegasus Components GmbH

Germany . 1,500 parts In-Stock

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1,500

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 157 parts In-Stock

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157

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Distributors (Availability)

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AZTECH Wire

Italy . 343 parts In-Stock

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$11.048

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343

$11.048

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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5,500

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Continental Prestige Electronics

USA . 5,281 parts In-Stock

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5,281

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Argo Parts USA

USA . 300 parts In-Stock

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300

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Perfect Parts

USA . 20 parts In-Stock

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20

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Overview

Discover the superior performance and reliability of the Vishay Intertechnology SI7601DN-T1-GE3 P-CHANNEL Power FET. Perfect for a wide range of applications, this single configuration transistor offers a maximum drain current of 16 A and power dissipation of 52 W. With cutting-edge metal-oxide semiconductor technology, this FET operates at temperatures up to 150°C, ensuring optimal efficiency and durability. Trust Vishay Intertechnology for top-quality components that deliver exceptional value and performance for your electronic projects.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL FETs are suitable for applications requiring high-side switching, making this product versatile in various circuit designs.

Configuration: SINGLE

Single configuration FETs are easy to implement and control in circuits, simplifying the design process.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and enabling efficient assembly.

Maximum Drain Current (Abs) (ID): 16 A

High maximum drain current rating of 16A enables the FET to handle high-power applications without the risk of overheating.

Maximum Power Dissipation (Abs): 52 W

With a maximum power dissipation of 52W, this FET can operate efficiently even in high-power applications, ensuring reliable performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good efficiency and robust performance, making this FET a reliable choice for various applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high-temperature environments, ensuring stable operation in harsh conditions.

Maximum Drain Current (ID): 16 A

The high maximum drain current rating of 16A allows this FET to handle demanding loads in a circuit, making it a suitable choice for power applications.

Technical Specifications

Power Field Effect Transistors (FET) SI7601DN-T1-GE3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Other Transistors

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SI7601DN-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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