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SI7483ADP-T1-E3

Vishay Intertechnology

SI7483ADP-T1-E3 by Vishay Intertechnology

Vishay Intertechnology's SI7483ADP-T1-E3 is a P-CHANNEL FET for switching applications. Features include 30V DS breakdown voltage, 60A IDM, and 0.0057 ohm RDS(on). With a max power dissipation of 5.4W and operating temperature up to 150°C, it is ideal for high-power circuit designs.

Median Price

$2.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 30 parts In-Stock

1+ parts

$2.500

100+ parts

$1.880

1k+ parts

$1.630

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30

$2.500

$1.880

$1.630

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Chip Stock

USA . 7,127 parts In-Stock

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Vyrian

USA . 3,536 parts In-Stock

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3,536

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 684 parts In-Stock

1+ parts

$1.586

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684

$1.586

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Aztec Data Supply Inc.

USA . 3,499 parts In-Stock

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$1.850

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3,499

$1.850

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AZTECH Wire

Italy . 662 parts In-Stock

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$12.173

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662

$12.173

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Ampacity Inc.

Singapore . 1,364 parts In-Stock

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$43.050

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1,364

$43.050

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Continental Prestige Electronics

USA . 4,460 parts In-Stock

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Argo Parts USA

USA . 4,349 parts In-Stock

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GreenTree Electronics

Israel . 4,190 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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500

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Kepictronics

USA . 500 parts In-Stock

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500

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Overview

Enhance the power and efficiency of your electronic devices with the Vishay Intertechnology SI7483ADP-T1-E3 Power Field Effect Transistor. This P-CHANNEL transistor with a built-in diode is perfect for switching applications, offering reliable performance and durability. With a maximum drain current of 14A and a low on-resistance of 0.0057 ohm, this transistor ensures optimal power management. Trust in Vishay's expertise in semiconductor technology to deliver high-quality components that will elevate your product's performance. Upgrade your devices with the SI7483ADP-T1-E3 and experience superior power control like never before.

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high efficiency and low power consumption, making them ideal for power-saving applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and can protect against reverse currents, increasing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, making it suitable for various electronic devices.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages, enhancing its versatility.

Package Shape: RECTANGULAR

Rectangular package shape offers easy integration and mounting in circuit boards.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs have a higher input impedance, enabling easier control and better performance in switching applications.

Maximum Pulsed Drain Current (IDM): 60 A

High pulsed drain current capability allows for handling short bursts of high currents, suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 14 A

A maximum drain current of 14A indicates high power handling capacity, making it suitable for medium-power applications.

Package Style (Meter): SMALL OUTLINE

Small outline packages are space-saving and easy to handle, making installation and assembly simple.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low input capacitance and high switching speeds, making it suitable for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high temperatures, increasing its reliability in harsh environments.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its stability and performance in electronic devices.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring a reliable electrical connection.

Maximum Drain-Source On Resistance: 0.0057 ohm

Low drain-source on-resistance results in minimal power loss and high efficiency during operation.

Case Connection: DRAIN

Drain connection allows for easy heat dissipation and efficient cooling, improving overall reliability and longevity.

Technical Specifications

Power Field Effect Transistors (FET) SI7483ADP-T1-E3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.0057 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI7483ADP-T1-E3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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