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SI4840BDY-T1-GE3

Vishay Intertechnology

SI4840BDY-T1-GE3 by Vishay Intertechnology

SI4840BDY-T1-GE3 by Vishay Intertechnology is a N-channel FET with 40V DS breakdown voltage and 19A max drain current. Ideal for switching applications, it operates in enhancement mode with a built-in diode. The transistor features a small outline package, -55 to 150°C operating temperature range, and 0.009 ohm max drain-source resistance.

Median Price

$0.609

Lifecycle Status

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27

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1k+

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UK . 35 parts In-Stock

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$0.530

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Newark

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Farnell

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RS Americas

USA . 510 parts In-Stock

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Element14

Singapore . 14,368 parts In-Stock

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DigiKey

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Mouser Electronics

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$0.735

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$0.696

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TTI Europe

Germany . 87,500 parts In-Stock

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TTI

USA . 5,000 parts In-Stock

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EBV Elektronik

Germany . 5,000 parts In-Stock

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Chip1Stop

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Arrow

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Verical

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Nova Conductors

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Chip Stock

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Vyrian

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Schukat

Germany . 11,900 parts In-Stock

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NAC Semi

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IBS Electronics

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Rutronik

Germany . 2,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,398 parts In-Stock

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Dan-Mar Components

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Lantek

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Speed Components Ltd

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Semicontronic

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Ampacity Inc.

Singapore . 13,654 parts In-Stock

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Continental Prestige Electronics

USA . 4,990 parts In-Stock

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Allen Electronics Distributors

USA . 510 parts In-Stock

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$1.610

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Aztec Data Supply Inc.

USA . 173 parts In-Stock

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Microchip USA

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Lucentia Tech

USA . 13,861 parts In-Stock

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Epart123

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Eastek

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Futuretech Components

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Formix International (Excess)

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ChipstoGo Electronic ltd

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Overview

Discover the cutting-edge technology of Vishay Intertechnology's SI4840BDY-T1-GE3 Small Signal Field Effect Transistor. This high-quality N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering enhanced performance and reliability. With a maximum drain current of 19A and minimum DS breakdown voltage of 40V, this transistor provides exceptional power dissipation and efficiency. Trust Vishay Intertechnology to deliver top-of-the-line components for your electronic projects. Upgrade your designs with the SI4840BDY-T1-GE3 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers efficient switching capabilities and is commonly used in power electronics applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by incorporating a diode within the transistor package, saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and reliable performance in on/off states.

Package Shape: RECTANGULAR

Facilitates easy mounting and placement on circuit boards, optimizing space usage.

Maximum Drain Current (Abs) (ID): 19 A

Can handle high levels of current, making it suitable for power electronics applications that require efficient current flow.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high input impedance and low output impedance, resulting in efficient signal amplification and switching capabilities.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without degradation in performance, suitable for industrial and automotive applications.

Maximum Drain-Source On Resistance: 0.009 ohm

Provides low resistance for efficient current flow and minimal power loss, enhancing overall performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) SI4840BDY-T1-GE3 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.009 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MS-012AA

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

6 W

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SI4840BDY-T1-GE3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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