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IRFD014

Vishay Intertechnology

IRFD014 by Vishay Intertechnology

Vishay Intertechnology's IRFD014 is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 14A IDM and 130mJ EAS, it operates in ENHANCEMENT MODE with 0.2 ohm RDS(on). The PLASTIC/EPOXY package has IN-LINE style and can handle up to 1.3W power dissipation at 175°C.

Median Price

$2.940

Lifecycle Status

Suppliers In-Stock

30

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Forefront Electronics and Design

USA . 1,500 parts In-Stock

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J2 Sourcing AB

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Bristol Electronics

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Atlantic Semiconductor

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PC Components Company LLC

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LIBRA Elektronik GmbH

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Connector Distribution Corp

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AZTECH Wire

Italy . 866 parts In-Stock

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Overview

Discover the cutting-edge IRFD014 Power FET by Vishay Intertechnology, a trusted manufacturer in the field. This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering a minimum DS breakdown voltage of 60V and a maximum pulsed drain current of 14A. With a package style that is both practical and durable, this transistor is designed for enhancement mode operation with a maximum operating temperature of 175°C. Experience high-quality performance and reliability with the IRFD014, providing value and efficiency for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable construction, making it ideal for portable applications.

Polarity or Channel Type: N-CHANNEL

N-Channel type FETs offer low ON resistance and high switching speeds, making them efficient for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, enhancing the overall reliability of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can quickly turn ON and OFF, providing high efficiency and precise control.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage, this FET can withstand high voltage spikes, ensuring durability and reliability in harsh environments.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of PCB space, making it a practical choice for compact designs.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a sturdy connection to the PCB, offering reliability and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for easy control of the FET's conductivity, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 14 A

The high pulsed drain current capability enables the FET to handle peak currents without overheating, making it reliable for high power applications.

Avalanche Energy Rating (EAS): 130 mJ

The high avalanche energy rating ensures that the FET can handle energy spikes, protecting the circuit from damage.

Maximum Drain Current (Abs) (ID): 1.7 A

With a maximum drain current of 1.7 A, this FET can handle moderate power loads, making it versatile for various applications.

No. of Terminals: 3

The three terminals provide flexibility in wiring configurations, allowing for customization to suit different circuit requirements.

Maximum Power Dissipation (Abs): 1.3 W

The high power dissipation capability ensures that the FET can handle heat generated during operation, prolonging its lifespan.

Package Style (Meter): IN-LINE

The in-line package style offers a compact and streamlined design, ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology enables high switching speeds and low ON resistance, making it efficient for power management applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can perform reliably in high-temperature environments, ensuring long-term stability.

Transistor Element Material: SILICON

Silicon-based transistor elements provide excellent performance and reliability, making the FET suitable for a wide range of applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish offers good solderability and corrosion resistance, ensuring a reliable connection in various operating conditions.

Maximum Drain-Source On Resistance: 0.2 ohm

The low drain-source on resistance results in minimal power loss and efficient operation, making it suitable for high-performance applications.

Terminal Position: DUAL

The dual terminal position allows for versatile connectivity options, making it easy to integrate into different circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) IRFD014 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Vishay Intertechnology

Specs

Avalanche Energy Rating (EAS):

130 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

1.7 A

Maximum Drain Current (ID):

1.7 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDIP-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

14 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRFD014 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Vishay Intertechnology

Vishay Intertechnology, Inc. is a renowned American manufacturer of discrete semiconductors and passive electronic components that have been used in many consumer products and industrial applications worldwide. Founded by Polish-born businessman Felix Zandman in 1962, Vishay has grown to become one of the world's largest manufacturers of these components, with a strong presence in every major market around the globe. The company also offers value-added solutions such as its patented passive components, replacing a number of legacy parts with more reliable, cost effective solutions.

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Management team

Executive Chairman of the Board, Chief Business Development Officer

Marc Zandman

Chief Executive Officer, President, and Director

Joel Smejkal

Executive Vice President and Chief Financial Officer

Lori Lipcaman

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

Itzehoe - Fab Phase 1

Fabrication

Fab Initiation

2025

Germany

Itzehoe

Wafer Capacity

2025

US - Fab 3

Fabrication

Fab Initiation

1986

USA

Santa Clara

Wafer Capacity

24,500

1986

24,500

US - Fab 2

Fabrication

Fab Initiation

1972

USA

Santa Clara

Wafer Capacity

8,000

1972

8,000

Austria

Fabrication

Fab Initiation

1984

Austria

Vöcklabruck

Wafer Capacity

25,000

1984

25,000

Taiwan

Fabrication

Fab Initiation

1967

Taiwan

Hsintien

Wafer Capacity

12,000

1967

12,000

Italy - Fab 8

Fabrication

Fab Initiation

1961

Canada

Torino

Wafer Capacity

15,000

1961

15,000

Israel

Fabrication

Fab Initiation

2000

Israel

Yokneam Illit

Wafer Capacity

400

2000

400

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