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XAM1705BPTP3

Texas Instruments

XAM1705BPTP3 by Texas Instruments

XAM1705BPTP3 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 50 MHz. It features low power mode and boundary scan capabilities, suitable for applications requiring high-speed processing in compact designs. The package style includes flatpack and heat sink/slug options, with a terminal pitch of 0.5 mm for easy integration into various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,198 parts In-Stock

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Digiode

USA . 1,869 parts In-Stock

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1,869

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Distributors (Availability)

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AZTECH Wire

Italy . 404 parts In-Stock

1+ parts

$9.023

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404

$9.023

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One Stop Electronics

USA . 1,331 parts In-Stock

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$25.000

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1,331

$25.000

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Parana Technologies

USA . 1,149 parts In-Stock

1+ parts

$70.530

100+ parts

$6,549.765

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$63.477

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1,149

$70.530

$6,549.765

$63.477

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DigiPath Technology Company

USA . 141 parts In-Stock

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$77.662

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141

$77.662

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ChromeModa Solutions

Germany . 5,415 parts In-Stock

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$79.247

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$64.983

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5,415

$79.247

$64.983

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IDEA Electronic Components Group

UK . 1,388 parts In-Stock

1+ parts

$79.247

100+ parts

$75.285

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$71.322

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1,388

$79.247

$75.285

$71.322

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Corphita

USA . 1,379 parts In-Stock

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1,379

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Microchip USA

USA . 251 parts In-Stock

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Overview

Experience unmatched performance and reliability with the XAM1705BPTP3 by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and cutting-edge technology in their microprocessors. This versatile product is perfect for a wide range of applications, providing seamless integration and optimal functionality. With integrated cache and low power mode, customers can enjoy enhanced efficiency and productivity. Trust Texas Instruments to deliver unparalleled value and benefits with the XAM1705BPTP3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during handling and installation.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance and efficiency of the microprocessor by reducing the access time to frequently used data.

Maximum Supply Voltage: 1.32 V

A higher maximum supply voltage allows for better performance and stability under heavy workloads or overclocking scenarios.

Package Shape: SQUARE

The square shape of the package allows for easier integration into circuit boards and better thermal dissipation compared to other shapes.

Bit Size: 32

A 32-bit architecture allows for processing and handling of larger chunks of data, improving the overall speed and efficiency of the microprocessor.

Power Supplies (V): 1.2, 1.8, 3.3

Having multiple power supply options allows for flexibility in design and compatibility with various systems and power requirements.

No. of Terminals: 176

A higher number of terminals allow for more connectivity options and capabilities, enabling the microprocessor to interface with a wide range of devices and peripherals.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage helps in reducing power consumption and heat generation, leading to improved energy efficiency and longer lifespan.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the microprocessor can withstand intense workload and environmental conditions without performance degradation.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliable performance in a wide range of environments, making this microprocessor suitable for various applications.

Terminal Position: QUAD

The quad-terminal position provides a stable and secure connection to the circuit board, reducing the risk of signal interference or damage during operation.

Speed: 375 rpm

With a high speed rating, this microprocessor can quickly process data and instructions, making it suitable for demanding tasks and applications.

Low Power Mode: YES

The low power mode feature allows the microprocessor to reduce power consumption when not operating at full capacity, helping to conserve energy and extend battery life in mobile devices.

Technical Specifications

Microprocessors XAM1705BPTP3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G176

Length:

24 mm

Low Power Mode:

YES

No. of Terminals:

176

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

.3 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

24 mm

Peripheral IC Type:

Trade Compliance

XAM1705BPTP3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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