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USBN9603-28M

Texas Instruments

USBN9603-28M by Texas Instruments

The Texas Instruments USBN9603-28M is a Bus Controller IC with 8-bit address and data bus width, operating at up to 24 MHz. It supports both 3.3V and 5V power supplies, making it suitable for various commercial applications requiring USB bus control in compact designs. The package style is small outline with dual-position terminals, ideal for space-constrained environments.

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Connector Distribution Corp

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Odi Ramu Company

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PC Components Company LLC

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Atlantic Semiconductor

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ACDS - Activité Composants Distribution Service

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Mentor Electronics Marketing, LLC

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One Stop Electronics

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AZTECH Wire

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ChromeModa Solutions

Germany . 2,646 parts In-Stock

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IDEA Electronic Components Group

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Overview

Unlock the power of seamless data transfer with the Texas Instruments USBN9603-28M Bus Controller. Crafted with precision and expertise, this device offers unparalleled reliability and performance for a wide range of applications. Whether you're looking to streamline your business operations or enhance your personal projects, this universal serial bus controller is guaranteed to deliver unmatched value and efficiency. Experience the difference with Texas Instruments and take your connectivity to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the bus controller, making it resistant to physical damage.

Surface Mount: YES

Surface mount design allows for easy and efficient installation onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Supports a high maximum supply voltage, ensuring compatibility with various power sources and reducing the risk of voltage issues.

Address Bus Width: 8

8-bit address bus width allows for efficient communication and data transfer between devices, enhancing overall performance.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into electronic systems and circuit designs, optimizing space utilization.

Power Supplies (V): 3.3/5

Compatible with both 3.3V and 5V power supplies, providing flexibility and compatibility for a wide range of applications.

No. of Terminals: 28

Ample number of terminals allow for connectivity to various components and peripherals, making the bus controller versatile in use.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and in electronic devices, contributing to efficient design and layout.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with lower power sources, enhancing the potential range of applications for the bus controller.

Maximum Operating Temperature: 70 °C

High maximum operating temperature provides reliability in various environments and under different conditions, ensuring consistent performance.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of climates and settings, from cold environments to room temperature conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and conductivity, ensuring reliable connections for efficient operation.

Terminal Position: DUAL

Dual terminal position provides flexibility in installation and connectivity options, accommodating different circuit layouts and configurations.

Maximum Seated Height: 2.65 mm

Low maximum seated height helps in conserving space within electronic devices and systems, contributing to compact design solutions.

Width: 7.5 mm

Narrow width enables easy integration and placement of the bus controller in tight spaces or densely populated circuit boards.

External Data Bus Width: 8

8-bit external data bus width facilitates efficient data transfer between the bus controller and connected devices, enhancing overall performance.

Maximum Clock Frequency: 24 MHz

High maximum clock frequency enables fast data processing and communication speeds, contributing to quick and responsive performance.

Maximum Time At Peak Reflow Temperature (s): 20

Short reflow time at peak temperature ensures quick and effective soldering during manufacturing or assembly processes, reducing production time.

Peak Reflow Temperature °C: 220

High peak reflow temperature allows for robust and secure soldering connections, ensuring reliability and performance under varying conditions.

Length: 17.9 mm

Moderate length provides sufficient space for component connections and routing while keeping the overall footprint of the bus controller compact.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard operating temperatures commonly found in commercial electronics and devices.

Peripheral IC Type: BUS CONTROLLER, UNIVERSAL SERIAL BUS

Peripheral IC type as a bus controller for Universal Serial Bus (USB) offers versatile interface capabilities for data transfer and communication.

Technology: CMOS

CMOS technology provides energy-efficient operation and reliable performance, making the bus controller suitable for various low-power applications.

Terminal Form: GULL WING

Gull wing terminal form offers robustness and ease of soldering during assembly, ensuring secure connections for stable operation.

Maximum Supply Current: 40 mA

Low maximum supply current consumption helps in reducing power usage and heat generation, making the bus controller energy-efficient.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V provides stable power input for optimal performance and compatibility with standard power sources.

Terminal Pitch: 1.27 mm

Standard terminal pitch allows for easy integration and connection with other components, facilitating efficient assembly and circuit design.

Moisture Sensitivity Level (MSL): 3

MSL of 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage to maintain the quality and reliability of the bus controller.

Technical Specifications

Bus Controllers USBN9603-28M attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

8

Maximum Clock Frequency:

24 MHz

External Data Bus Width:

8

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

220

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.5 mm

Trade Compliance

USBN9603-28M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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