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USBN9603-28MX

Texas Instruments

USBN9603-28MX by Texas Instruments

The Texas Instruments USBN9603-28MX is a bus controller with 28 terminals, operating at 3.3/5V. It features a small outline package, Gull Wing terminal form, and can handle temperatures from 0 to 70°C. Ideal for applications requiring surface mount technology in commercial-grade environments.

Median Price

$9.230

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 178 parts In-Stock

1+ parts

$9.230

100+ parts

$6.920

1k+ parts

$6.000

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178

$9.230

$6.920

$6.000

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Digiode

USA . 3,033 parts In-Stock

1+ parts

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3,033

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Vyrian

USA . 2,191 parts In-Stock

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2,191

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Anansix

USA . 1,804 parts In-Stock

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1,804

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ComSIT Distribution GmbH

Germany . 770 parts In-Stock

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770

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ComSIT USA

USA . 770 parts In-Stock

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770

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Martec Srl

Italy . 100 parts In-Stock

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100

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Bristol Electronics

USA . 70 parts In-Stock

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70

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 145 parts In-Stock

1+ parts

$4.000

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-

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145

$4.000

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AZTECH Wire

Italy . 678 parts In-Stock

1+ parts

$13.953

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678

$13.953

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Corohmni

South Africa . 5,069 parts In-Stock

1+ parts

$33.633

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5,069

$33.633

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Parana Technologies

USA . 377 parts In-Stock

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$63.363

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377

$63.363

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DigiPath Technology Company

USA . 490 parts In-Stock

1+ parts

$69.770

100+ parts

$64.189

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490

$69.770

$64.189

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ChromeModa Solutions

Germany . 5,912 parts In-Stock

1+ parts

$71.194

100+ parts

$58.379

1k+ parts

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5,912

$71.194

$58.379

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IDEA Electronic Components Group

UK . 2,054 parts In-Stock

1+ parts

$71.194

100+ parts

$67.634

1k+ parts

$64.075

10k+ parts

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2,054

$71.194

$67.634

$64.075

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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4,000

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Corphita

USA . 1,152 parts In-Stock

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1,152

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Overview

Unlock the power of seamless data transmission with the USBN9603-28MX by Texas Instruments. As a leader in innovative technology solutions, Texas Instruments ensures top-notch quality and reliability in their products. The USBN9603-28MX falls under the category of Bus Controllers, perfect for various applications requiring efficient data transfer. Experience the convenience and efficiency this product offers with its small outline package style and dual terminal position. Trust Texas Instruments to provide you with the best value, benefits, and advantages in your technology needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to impact, making the product suitable for rugged environments.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and improving overall design aesthetics.

Power Supplies (V): 3.3/5

Versatile power supply options cater to different system requirements, providing flexibility in usage.

No. of Terminals: 28

The ample number of terminals allow for connectivity to multiple components and peripherals, enhancing the product's functionality.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand extended use without risk of overheating or performance degradation.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good conductivity and reliability in data transmission, contributing to the product's overall performance.

Terminal Position: DUAL

Dual terminal positioning enables secure connections and reduces the risk of signal interference or loss, ensuring stable operation.

Terminal Pitch: 1.27 mm

The fine terminal pitch allows for high-density mounting, improving PCB layout efficiency and enabling compact designs.

Technical Specifications

Bus Controllers USBN9603-28MX attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Maximum Supply Current:

40 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

USBN9603-28MX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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