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UCD9244ARGCR

Texas Instruments

UCD9244ARGCR by Texas Instruments

UCD9244ARGCR by Texas Instruments is a switching controller with 4 outputs. It operates b/w -40 to 85°C, using pulse width modulation control technique. Ideal for industrial applications requiring high-temperature tolerance and precise power regulation in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,430 parts In-Stock

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5,430

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Digiode

USA . 3,942 parts In-Stock

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3,942

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Distributors (Availability)

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Ampacity Inc.

Singapore . 514 parts In-Stock

1+ parts

$3.500

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514

$3.500

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Semicontronic

India . 1,395 parts In-Stock

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$4.500

100+ parts

$4.388

1k+ parts

$4.365

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1,395

$4.500

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$4.365

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One Stop Electronics

USA . 1,188 parts In-Stock

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$7.500

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1,188

$7.500

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AZTECH Wire

Italy . 699 parts In-Stock

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$7.675

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699

$7.675

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Parana Technologies

USA . 549 parts In-Stock

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$10.624

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$11.117

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549

$10.624

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$11.117

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DigiPath Technology Company

USA . 625 parts In-Stock

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$11.698

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625

$11.698

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ChromeModa Solutions

Germany . 6,057 parts In-Stock

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$11.937

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$9.788

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6,057

$11.937

$9.788

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IDEA Electronic Components Group

UK . 2,284 parts In-Stock

1+ parts

$11.937

100+ parts

$11.340

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$10.743

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2,284

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$11.340

$10.743

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Corphita

USA . 484 parts In-Stock

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Corohmni

South Africa . 414 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the UCD9244ARGCR switching regulator & controller. This cutting-edge product is perfect for a variety of applications, offering customers superior performance and efficiency. Say goodbye to worries about temperature limits with its industrial-grade design, while enjoying the convenience of a surface-mount package style. Trust in Texas Instruments for top-notch technology that delivers on value and benefits for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation properties and can withstand high temperatures, making the product durable and reliable.

Surface Mount: YES

Surface mount capability allows for easy, efficient assembly onto PCBs, saving time and space in the overall system design.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy integration into compact electronic devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Chip carrier, heat sink/slug, and very thin profile package styles enhance thermal management, improve performance, and enable a sleek design for the product.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable operation in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in cold environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring a stable electrical connection.

Terminal Position: QUAD

Quad terminal position facilitates easy connectivity and integration in multi-channel applications.

Other IC type: SWITCHING CONTROLLER

Switching controller IC type offers efficient power conversion and regulation, minimizing power loss and improving overall energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature minimizes thermal stress on the components during assembly, increasing product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder reflow and strong mechanical bonds during assembly, enhancing product durability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certifies the product for use in harsh industrial environments with extended temperature ranges.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and offers improved solder joint reliability for long-term performance.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique allows for precise regulation of output voltage and current, ensuring stable and efficient power delivery.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product can withstand standard moisture exposure during handling and assembly processes.

No. of Outputs: 4

Having four outputs provides versatility in power distribution and system configuration, making the product suitable for multi-channel applications.

Technical Specifications

Switching Regulators & Controllers UCD9244ARGCR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Technique:

PULSE WIDTH MODULATION

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

UCD9244ARGCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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