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UCD9111RHBT

Texas Instruments

UCD9111RHBT by Texas Instruments

UCD9111RHBT by Texas Instruments is a VOLTAGE-MODE SWITCHING CONTROLLER with 32 terminals in a SQUARE CHIP CARRIER package. It operates b/w -40 to 85 °C, has a max switching frequency of 2000 kHz, and is ideal for industrial applications requiring PULSE WIDTH MODULATION control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,886 parts In-Stock

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3,886

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Digiode

USA . 2,201 parts In-Stock

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2,201

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 817 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

817

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,474 parts In-Stock

1+ parts

$2.500

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1,474

$2.500

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One Stop Electronics

USA . 842 parts In-Stock

1+ parts

$3.500

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842

$3.500

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AZTECH Wire

Italy . 597 parts In-Stock

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$9.613

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597

$9.613

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Parana Technologies

USA . 1,317 parts In-Stock

1+ parts

$17.219

100+ parts

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$17.434

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1,317

$17.219

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$17.434

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DigiPath Technology Company

USA . 2,353 parts In-Stock

1+ parts

$18.960

100+ parts

$17.443

1k+ parts

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2,353

$18.960

$17.443

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IDEA Electronic Components Group

UK . 808 parts In-Stock

1+ parts

$19.347

100+ parts

$18.380

1k+ parts

$17.412

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808

$19.347

$18.380

$17.412

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ChromeModa Solutions

Germany . 429 parts In-Stock

1+ parts

$19.347

100+ parts

$15.865

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429

$19.347

$15.865

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Corphita

USA . 592 parts In-Stock

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592

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Corohmni

South Africa . 232 parts In-Stock

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Overview

Explore the endless possibilities with the UCD9111RHBT by Texas Instruments, a top-tier manufacturer known for delivering high-quality switching regulators & controllers. This versatile chip carrier offers a very thin profile and 32 terminals, making it ideal for a wide range of industrial applications. With a control mode of voltage-mode and a maximum switching frequency of 2000 kHz, this switching controller ensures optimal performance and efficiency. Say goodbye to power-related worries and elevate your projects with the UCD9111RHBT - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Package Shape: SQUARE

Square package shape facilitates space-saving design and efficient PCB layout.

No. of Terminals: 32

32 terminals provide ample connectivity options for various system configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier, heat sink/slug, and very thin profile package style offer excellent thermal management and compact design.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in demanding environmental conditions.

Control Mode: VOLTAGE-MODE

Voltage-mode control mode offers precise voltage regulation and stability.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to operate in a wide range of temperature conditions.

Terminal Position: QUAD

Quad terminal position provides efficient signal routing and connectivity.

Maximum Seated Height: 1 mm

Low maximum seated height allows for compact and slim design implementations.

Width (mm): 5 mm

Narrow width of 5mm enables the product to fit in tight spaces.

Other IC type: SWITCHING CONTROLLER

Utilizing a switching controller IC type offers efficient power management and control capabilities.

Nominal Input Voltage: 3.3 V

3.3V nominal input voltage is commonly used in various electronic systems, providing compatibility.

Length: 5 mm

Short length of 5mm contributes to the compact size and efficient PCB layout of the product.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Maximum Switching Frequency: 2000 kHz

High maximum switching frequency of 2000kHz enables fast and efficient power conversion.

Terminal Form: NO LEAD

No-lead terminal form simplifies PCB assembly and improves reliability.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers precise and efficient power regulation.

Switcher Config: PUSH-PULL

Push-pull switcher configuration provides high efficiency and low power loss in power conversion.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density PCB design.

Minimum Input Voltage: 3.14 V

Low minimum input voltage of 3.14V ensures compatibility with low-voltage power sources.

Maximum Input Voltage: 3.46 V

Maximum input voltage of 3.46V provides a suitable operating range for the product.

Technical Specifications

Switching Regulators & Controllers UCD9111RHBT attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

3.46 V

Minimum Input Voltage:

3.14 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

2000 kHz

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

UCD9111RHBT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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