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UCD9111RHBR

Texas Instruments

UCD9111RHBR by Texas Instruments

UCD9111RHBR by Texas Instruments is a voltage-mode switching controller with a max operating temperature of 85°C. It features a max switching frequency of 2MHz and is ideal for industrial applications requiring precise pulse width modulation control. This chip carrier package with very thin profile has 32 terminals, making it suitable for compact designs in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,914 parts In-Stock

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3,914

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Digiode

USA . 658 parts In-Stock

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658

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Distributors (Availability)

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One Stop Electronics

USA . 1,511 parts In-Stock

1+ parts

$0.500

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1,511

$0.500

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Semicontronic

India . 1,014 parts In-Stock

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$0.500

100+ parts

$0.488

1k+ parts

$0.485

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1,014

$0.500

$0.488

$0.485

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Ampacity Inc.

Singapore . 1,152 parts In-Stock

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$6.500

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1,152

$6.500

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AZTECH Wire

Italy . 487 parts In-Stock

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$14.939

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487

$14.939

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Parana Technologies

USA . 137 parts In-Stock

1+ parts

$20.536

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$20.615

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137

$20.536

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$20.615

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DigiPath Technology Company

USA . 1,555 parts In-Stock

1+ parts

$22.613

100+ parts

$20.804

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1,555

$22.613

$20.804

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ChromeModa Solutions

Germany . 6,528 parts In-Stock

1+ parts

$23.074

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$18.921

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6,528

$23.074

$18.921

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IDEA Electronic Components Group

UK . 1,430 parts In-Stock

1+ parts

$23.074

100+ parts

$21.920

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$20.767

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1,430

$23.074

$21.920

$20.767

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A-Z Elektronik GmbH

Germany . 5,565 parts In-Stock

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5,565

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Corphita

USA . 3,630 parts In-Stock

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3,630

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Corohmni

South Africa . 370 parts In-Stock

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370

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Overview

Experience superior performance and reliability with the UCD9111RHBR by Texas Instruments, a cutting-edge switching regulator/controller that offers unmatched quality and precision in power management. Designed for a wide range of applications, this innovative product combines state-of-the-art technology with the trusted reputation of its manufacturer to deliver exceptional efficiency and versatility. Say goodbye to power fluctuations and hello to seamless operation with the UCD9111RHBR, providing value and benefits that will exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and heat resistance, making the product durable and reliable.

Surface Mount: YES

Allows for easy installation and helps save space on the PCB.

No. of Terminals: 32

Offers flexibility in connectivity and functionality.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Optimal package style for efficient heat dissipation and compact design.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without performance degradation.

Control Mode: VOLTAGE-MODE

Provides precise control over output voltage, ensuring stability.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions.

Nominal Input Voltage: 3.3 V

Works efficiently with standard input voltage levels, suitable for various applications.

Maximum Switching Frequency: 2000 kHz

High switching frequency allows for fast response and efficient power conversion.

Technical Specifications

Switching Regulators & Controllers UCD9111RHBR attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

3.46 V

Minimum Input Voltage:

3.14 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

PUSH-PULL

Maximum Switching Frequency:

2000 kHz

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

5 mm

Trade Compliance

UCD9111RHBR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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