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UC3638QG3

Texas Instruments

UC3638QG3 by Texas Instruments

UC3638QG3 by Texas Instruments is a Motion Control IC with +-15V power supplies, 20 terminals, and 0.5A max output current. It is a BRUSH DC MOTOR CONTROLLER suitable for commercial applications requiring precise motion control in tight spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,151 parts In-Stock

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7,151

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Digiode

USA . 1,787 parts In-Stock

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1,787

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,540 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

1,540

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 1,279 parts In-Stock

1+ parts

$6.500

100+ parts

-

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1,279

$6.500

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One Stop Electronics

USA . 276 parts In-Stock

1+ parts

$6.500

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-

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276

$6.500

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AZTECH Wire

Italy . 452 parts In-Stock

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$6.846

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452

$6.846

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Parana Technologies

USA . 170 parts In-Stock

1+ parts

$19.769

100+ parts

-

1k+ parts

$19.737

10k+ parts

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170

$19.769

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$19.737

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DigiPath Technology Company

USA . 1,047 parts In-Stock

1+ parts

$21.768

100+ parts

$20.026

1k+ parts

-

10k+ parts

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1,047

$21.768

$20.026

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ChromeModa Solutions

Germany . 4,638 parts In-Stock

1+ parts

$22.212

100+ parts

$18.214

1k+ parts

-

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4,638

$22.212

$18.214

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IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$22.212

100+ parts

$21.101

1k+ parts

$19.991

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609

$22.212

$21.101

$19.991

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Corphita

USA . 3,297 parts In-Stock

1+ parts

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3,297

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Perfect Parts

USA . 616 parts In-Stock

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616

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Corohmni

South Africa . 462 parts In-Stock

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462

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Microchip USA

USA . 402 parts In-Stock

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402

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Overview

Enhance your motion control systems with the UC3638QG3 by Texas Instruments. This high-quality IC offers reliable performance and precision control for a wide range of applications, from robotics to automotive systems. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this product is built to last. Experience the value and benefits of seamless motion control with the UC3638QG3 - delivering efficiency and accuracy to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, reducing production time and costs.

Nominal Supply Voltage (Vsup): 15 V

The 15V supply voltage provides a stable power source for the IC to operate reliably within its specified range.

Maximum Output Current: 0.5 A

The high maximum output current of 0.5A enables the IC to drive motors and other loads with high efficiency and performance.

Technology: BIPOLAR

The bipolar technology used in the IC ensures precise control and accurate output, making it suitable for motion control applications.

Technical Specifications

Motion Control ICs UC3638QG3 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-J20

Length:

8.965 mm

Nominal Negative Supply Voltage (Vsup):

-15 V

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

+-15

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

23 mA

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.965 mm

Trade Compliance

UC3638QG3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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