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UC3625L

Texas Instruments

UC3625L by Texas Instruments

UC3625L by Texas Instruments is a motion control IC with 28 terminals, operating b/w 0-70°C. It supports brushless DC motor control with a max output current of 0.2A and operates on a supply voltage range of 10-18V. The chip carrier package is ceramic, metal-sealed cofired, making it suitable for various commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,974 parts In-Stock

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6,974

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Digiode

USA . 2,405 parts In-Stock

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2,405

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Distributors (Availability)

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Semicontronic

India . 932 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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932

$0.500

$0.488

$0.485

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Parana Technologies

USA . 1,813 parts In-Stock

1+ parts

$1.263

100+ parts

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$2.029

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1,813

$1.263

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$2.029

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DigiPath Technology Company

USA . 1,741 parts In-Stock

1+ parts

$1.391

100+ parts

$1.279

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1,741

$1.391

$1.279

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ChromeModa Solutions

Germany . 2,656 parts In-Stock

1+ parts

$1.419

100+ parts

$1.164

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2,656

$1.419

$1.164

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IDEA Electronic Components Group

UK . 1,722 parts In-Stock

1+ parts

$1.419

100+ parts

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$1.277

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1,722

$1.419

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$1.277

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One Stop Electronics

USA . 1,012 parts In-Stock

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$3.500

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1,012

$3.500

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Ampacity Inc.

Singapore . 926 parts In-Stock

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$6.500

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926

$6.500

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AZTECH Wire

Italy . 870 parts In-Stock

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$10.751

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870

$10.751

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Corphita

USA . 1,731 parts In-Stock

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1,731

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Corohmni

South Africa . 250 parts In-Stock

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250

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Overview

Enhance your motion control applications with the Texas Instruments UC3625L, a high-quality Brushless DC Motor Controller designed to deliver top-notch performance. With a reputation for excellence in manufacturing, Texas Instruments ensures reliability and precision in every product. Ideal for a wide range of industrial and consumer electronics, this IC offers unparalleled value with its advanced technology and efficient design. Take your projects to the next level with the UC3625L and experience the benefits of seamless motion control like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent heat dissipation and protection, ensuring reliability and longevity of the motion control IC.

Surface Mount: YES

Being surface mountable makes the installation process easier and more efficient, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V provides a stable power source for the motion control IC to operate effectively.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options, enabling compatibility with a wide range of systems and components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this motion control IC can perform reliably in various environments without risk of overheating.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures functionality even in colder conditions, increasing the product's usability.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

The inclusion of a brushless DC motor controller expands the functionality of the motion control IC, making it suitable for a wider range of applications.

Maximum Output Current: 0.2 A

The maximum output current of 0.2A allows the motion control IC to effectively drive motors and other components with sufficient power.

Technology: BIPOLAR

The bipolar technology used in this motion control IC offers high precision and efficiency in controlling motor movements, enhancing overall performance.

Maximum Supply Voltage (Vsup): 18 V

The maximum supply voltage of 18V provides flexibility and compatibility with various power sources, making this motion control IC a versatile choice.

Technical Specifications

Motion Control ICs UC3625L attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-CQCC-N28

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.2 A

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Trade Compliance

UC3625L Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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