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UC2625NG4

Texas Instruments

UC2625NG4 by Texas Instruments

UC2625NG4 by Texas Instruments is a motion control IC with 12V nominal voltage and 2A max output current. Ideal for industrial applications, it features a rectangular package shape, 28 terminals, and operates b/w -40 to 85 °C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,845 parts In-Stock

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7,845

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Digiode

USA . 3,505 parts In-Stock

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3,505

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 778 parts In-Stock

1+ parts

$3.500

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778

$3.500

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One Stop Electronics

USA . 1,018 parts In-Stock

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$5.500

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1,018

$5.500

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AZTECH Wire

Italy . 322 parts In-Stock

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$5.578

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322

$5.578

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Parana Technologies

USA . 1,178 parts In-Stock

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$18.476

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$18.590

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1,178

$18.476

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$18.590

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IDEA Electronic Components Group

UK . 1,364 parts In-Stock

1+ parts

$20.759

100+ parts

$19.721

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$18.683

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1,364

$20.759

$19.721

$18.683

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ChromeModa Solutions

Germany . 521 parts In-Stock

1+ parts

$20.759

100+ parts

$17.022

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521

$20.759

$17.022

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Microchip USA

USA . 6,417 parts In-Stock

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6,417

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Continental Prestige Electronics

USA . 2,758 parts In-Stock

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Corphita

USA . 1,573 parts In-Stock

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1,573

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DigiPath Technology Company

USA . 995 parts In-Stock

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$18.716

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995

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$18.716

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Argo Parts USA

USA . 330 parts In-Stock

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330

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your motion control systems with the Texas Instruments UC2625NG4, a high-quality Brushless DC Motor Controller designed for industrial applications. With a reputation for excellence, Texas Instruments delivers reliable products that meet the demands of modern technology. This compact IC offers precision and efficiency, providing customers with seamless operation and optimal performance. Trust in Texas Instruments to provide the power and reliability you need for your motion control projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material is durable and lightweight, making the product sturdy yet easy to handle.

Package Shape

RECTANGULAR - The rectangular shape allows for easy integration into existing systems or designs.

Nominal Supply Voltage (Vsup)

12 V - The nominal supply voltage is common and easily accessible, ensuring compatibility with a wide range of power sources.

No. of Terminals

28 - With a high number of terminals, this product offers plenty of connectivity options for various components.

Package Style (Meter)

IN-LINE - The in-line package style is space-efficient and suitable for applications with limited room for components.

Maximum Operating Temperature

85 °C - The high maximum operating temperature ensures reliable performance even in challenging environments.

Minimum Operating Temperature

40 °C - The low minimum operating temperature ensures the product remains functional in cold conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - This finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position

DUAL - The dual terminal position offers flexibility in installation and ensures secure connections.

Width (mm)

15.24 mm - The compact width allows for easy integration into tight spaces or crowded circuit boards.

Other IC type

BRUSHLESS DC MOTOR CONTROLLER - This additional feature enables precise control of brushless DC motors for efficient and smooth operation.

Minimum Supply Voltage (Vsup)

10 V - The low minimum supply voltage enables the product to operate efficiently even with limited power sources.

Length

36.32 mm - The length of the product is optimal for accommodating the necessary components without taking up excessive space.

Temperature Grade

INDUSTRIAL - The industrial-grade temperature rating ensures the product can withstand harsh operating conditions common in industrial settings.

Maximum Supply Current (Isup)

30 mA - The low maximum supply current requirement helps conserve power and reduce overall energy consumption.

Maximum Output Current

2 A - The high maximum output current allows for driving demanding loads with ease.

Technology

BIPOLAR - The bipolar technology utilized in this product offers precise control and reliable performance.

Terminal Form

THROUGH-HOLE - The through-hole terminal form provides easy soldering and secure connections for reliable operation.

Terminal Pitch

2.54 mm - The standard terminal pitch enables compatibility with common connectors and ensures easy integration into existing setups.

Maximum Supply Voltage (Vsup)

18 V - The high maximum supply voltage provides flexibility in power source selection and compatibility with various systems.

Technical Specifications

Motion Control ICs UC2625NG4 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e4

Length:

36.32 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

15.24 mm

Trade Compliance

UC2625NG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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