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UC2625QTR

Texas Instruments

UC2625QTR by Texas Instruments

UC2625QTR by Texas Instruments is a Motion Control IC with 12V supply, 28 terminals, and 2A output current. Ideal for industrial applications, it's a Brushless DC Motor Controller in a square chip carrier package suitable for surface mount assembly. Operating temperature ranges from -40 to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,437 parts In-Stock

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8,437

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Digiode

USA . 2,302 parts In-Stock

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2,302

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Distributors (Availability)

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Semicontronic

India . 505 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

505

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 1,044 parts In-Stock

1+ parts

$5.500

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1,044

$5.500

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Ampacity Inc.

Singapore . 514 parts In-Stock

1+ parts

$7.500

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514

$7.500

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Parana Technologies

USA . 47 parts In-Stock

1+ parts

$14.517

100+ parts

-

1k+ parts

$14.957

10k+ parts

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47

$14.517

-

$14.957

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DigiPath Technology Company

USA . 1,604 parts In-Stock

1+ parts

$15.985

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1,604

$15.985

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ChromeModa Solutions

Germany . 5,585 parts In-Stock

1+ parts

$16.311

100+ parts

$13.375

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5,585

$16.311

$13.375

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IDEA Electronic Components Group

UK . 1,418 parts In-Stock

1+ parts

$16.311

100+ parts

$15.495

1k+ parts

$14.680

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1,418

$16.311

$15.495

$14.680

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AZTECH Wire

Italy . 765 parts In-Stock

1+ parts

$16.770

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765

$16.770

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Corohmni

South Africa . 488 parts In-Stock

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488

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Corphita

USA . 363 parts In-Stock

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363

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Overview

Unlock the full potential of your motion control applications with the UC2625QTR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products designed to meet the needs of today's demanding market. The UC2625QTR is a versatile Brushless DC Motor Controller that provides reliable performance and precise control. With a wide operating temperature range, high output current, and industrial-grade technology, this chip carrier package offers exceptional value and benefits for your projects. Experience efficiency and innovation with the UC2625QTR - choose Texas Instruments for your motion control solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation properties and is lightweight, making the product easy to handle and install.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 12 V

A 12V nominal supply voltage is commonly used in many applications, ensuring compatibility with existing systems.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, this product can withstand high temperatures, making it suitable for industrial environments.

Technology: BIPOLAR

Bipolar technology offers high precision and control, making it ideal for motion control applications that require accuracy and reliability.

Technical Specifications

Motion Control ICs UC2625QTR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J28

Length:

11.505 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

11.505 mm

Trade Compliance

UC2625QTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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