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UC2625J

Texas Instruments

UC2625J by Texas Instruments

UC2625J by Texas Instruments is a motion control IC with 12V nominal voltage and 0.2A max output current. Ideal for industrial applications, it features bipolar technology, operates b/w -40 to 105 °C, and has 28 terminals in an in-line package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,321 parts In-Stock

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Digiode

USA . 2,256 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 890 parts In-Stock

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$1.500

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890

$1.500

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Semicontronic

India . 272 parts In-Stock

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$1.500

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$1.462

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$1.455

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272

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,623 parts In-Stock

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$7.500

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$7.500

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Parana Technologies

USA . 419 parts In-Stock

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$15.532

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$15.905

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419

$15.532

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$15.905

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ChromeModa Solutions

Germany . 2,148 parts In-Stock

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$17.452

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$14.311

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$17.452

$14.311

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IDEA Electronic Components Group

UK . 29 parts In-Stock

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$17.452

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$16.579

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$15.707

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29

$17.452

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$15.707

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AZTECH Wire

Italy . 705 parts In-Stock

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$19.805

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$19.805

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Corphita

USA . 2,561 parts In-Stock

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DigiPath Technology Company

USA . 649 parts In-Stock

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$15.735

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Corohmni

South Africa . 415 parts In-Stock

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Overview

Enhance the performance of your motion control applications with the UC2625J by Texas Instruments. This top-quality BRUSHLESS DC MOTOR CONTROLLER offers unparalleled reliability and precision, thanks to its advanced technology and industrial-grade temperature grade. With a nominal supply voltage of 12V and maximum output current of 0.2A, this motion control IC provides optimal power management for a wide range of industrial applications. Invest in the UC2625J today and experience seamless operation, improved efficiency, and unmatched quality in your motion control systems.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and reliability, ensuring the product can withstand harsh operating conditions.

Nominal Supply Voltage (Vsup): 12 V

The 12 V supply voltage is common and easily accessible, making it convenient for integration into existing systems.

Maximum Operating Temperature: 105 °C

The high operating temperature range allows the product to function efficiently in various industrial environments.

Technology: BIPOLAR

The bipolar technology offers precise control and accuracy, crucial for motion control applications.

Maximum Output Current: 0.2 A

The high output current capability ensures that the product can effectively drive motors and other components.

Technical Specifications

Motion Control ICs UC2625J attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-GDIP-T28

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.2 A

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

12

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

UC2625J Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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