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TWL6032A2B4YFFT

Texas Instruments

TWL6032A2B4YFFT by Texas Instruments

TWL6032A2B4YFFT by Texas Instruments is a Power Management IC with 155 terminals, supporting 17 channels and 14 outputs. It operates in industrial temperature range (-40 to 85°C) with output voltage ranging from 0.6V to 3.3V, making it suitable for power supply support circuits.

Median Price

$8.822

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,655 parts In-Stock

1+ parts

$10.339

100+ parts

$8.429

1k+ parts

$5.619

10k+ parts

-

1,655

$10.339

$8.429

$5.619

-

Rochester

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$8.270

1k+ parts

$7.400

10k+ parts

$6.960

400

-

$8.270

$7.400

$6.960

DigiKey

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$8.110

1k+ parts

-

10k+ parts

-

400

-

$8.110

-

-

Verical

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$9.375

1k+ parts

$8.475

10k+ parts

-

400

-

$9.375

$8.475

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,234 parts In-Stock

1+ parts

$7.581

100+ parts

-

1k+ parts

-

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2,234

$7.581

-

-

-

TEDSS.com

USA . 220 parts In-Stock

1+ parts

$10.000

100+ parts

$8.960

1k+ parts

-

10k+ parts

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220

$10.000

$8.960

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-

Vyrian

USA . 8,775 parts In-Stock

1+ parts

-

100+ parts

-

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8,775

-

-

-

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DigiKey Marketplace

USA . 400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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400

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,043 parts In-Stock

1+ parts

$2.662

100+ parts

-

1k+ parts

$3.149

10k+ parts

-

2,043

$2.662

-

$3.149

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DigiPath Technology Company

USA . 1,074 parts In-Stock

1+ parts

$2.931

100+ parts

$2.697

1k+ parts

-

10k+ parts

-

1,074

$2.931

$2.697

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ChromeModa Solutions

Germany . 6,476 parts In-Stock

1+ parts

$2.991

100+ parts

$2.453

1k+ parts

-

10k+ parts

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6,476

$2.991

$2.453

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IDEA Electronic Components Group

UK . 1,650 parts In-Stock

1+ parts

$2.991

100+ parts

-

1k+ parts

$2.692

10k+ parts

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1,650

$2.991

-

$2.692

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Corphita

USA . 1,358 parts In-Stock

1+ parts

$7.182

100+ parts

-

1k+ parts

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10k+ parts

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1,358

$7.182

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Overview

Enhance your devices with the TWL6032A2B4YFFT Power Management IC from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for various applications in power management. This versatile IC offers customers value through its efficient performance, wide range of output options, and compact design. With 17 channels and 14 outputs, this IC provides the flexibility and power you need for your next project. Upgrade your devices with the TWL6032A2B4YFFT and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for easy and efficient mounting on circuit boards, saving space and making assembly process simpler.

Package Shape: RECTANGULAR

The rectangular shape provides a compact form factor, ideal for applications where space is limited.

No. of Terminals: 155

Having a high number of terminals allows for versatile connections and functionality in the power management system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding industrial environments.

Minimum Output Voltage: 0.6 V

The low minimum output voltage makes it suitable for applications requiring precise power regulation at lower voltages.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in harsh environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of these materials for terminal finish ensures good conductivity and resistance to corrosion, enhancing the longevity of the product.

Maximum Output Voltage: 3.3 V

The high maximum output voltage caters to applications that require power regulation at relatively higher voltages.

Terminal Position: BOTTOM

The bottom terminal position facilitates efficient heat dissipation and connection with the circuit board.

Maximum Seated Height: 0.625 mm

The low seated height contributes to a slim and space-saving design, important in compact electronic devices.

Width (mm): 5.214 mm

The narrow width enables the IC to fit into tight spaces, making it suitable for miniaturized applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this IC aids in efficient power management and distribution within electronic systems.

Minimum Supply Voltage (Vsup): 2.5 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The quick reflow time allows for faster manufacturing processes, improving productivity.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the IC can withstand the soldering process without damage.

Length: 5.364 mm

The compact length of the IC contributes to a space-efficient design, crucial in portable devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies that the IC is designed to operate reliably in rugged industrial environments.

Maximum Output Current: 5 A

The high maximum output current rating makes this IC suitable for applications demanding a significant power output.

No. of Channels: 17

Having multiple channels allows for simultaneous power management of various functions or components, enhancing overall system efficiency.

Terminal Form: BALL

The ball terminal form enables reliable connections and efficient heat dissipation in the power management system.

Terminal Pitch: 0.4 mm

The tight terminal pitch ensures a compact layout on the circuit board, saving space and improving overall system integration.

Maximum Supply Voltage (Vsup): 4.8 V

The high maximum supply voltage rating caters to applications requiring power regulation at higher voltage inputs.

No. of Outputs: 14

Having multiple outputs allows for efficient distribution of power to different components or subsystems, enhancing overall system performance.

Technical Specifications

Power Management ICs TWL6032A2B4YFFT attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B155

JESD-609 Code:

e1

Length:

5.364 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

17

No. of Functions:

1

No. of Outputs:

14

No. of Terminals:

155

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

5 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.6 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.8 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.214 mm

Trade Compliance

TWL6032A2B4YFFT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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