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TWL1101GGV

Texas Instruments

TWL1101GGV by Texas Instruments

TWL1101GGV by Texas Instruments is a 64-terminal consumer IC with package style GRID ARRAY. Operating temp range -40 to 85°C, voltage range 2.7-3.5V, and max supply current of 11mA make it ideal for industrial applications requiring low profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,441

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Digiode

USA . 4,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,786

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,224 parts In-Stock

1+ parts

$0.947

100+ parts

$87.940

1k+ parts

$0.852

10k+ parts

-

1,224

$0.947

$87.940

$0.852

-

DigiPath Technology Company

USA . 1,682 parts In-Stock

1+ parts

$1.043

100+ parts

-

1k+ parts

-

10k+ parts

-

1,682

$1.043

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-

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ChromeModa Solutions

Germany . 1,899 parts In-Stock

1+ parts

$1.064

100+ parts

$0.872

1k+ parts

-

10k+ parts

-

1,899

$1.064

$0.872

-

-

IDEA Electronic Components Group

UK . 841 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

$0.958

10k+ parts

-

841

$1.064

-

$0.958

-

AZTECH Wire

Italy . 528 parts In-Stock

1+ parts

$6.290

100+ parts

-

1k+ parts

-

10k+ parts

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528

$6.290

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-

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One Stop Electronics

USA . 1,603 parts In-Stock

1+ parts

$13.800

100+ parts

-

1k+ parts

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10k+ parts

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1,603

$13.800

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Corphita

USA . 1,971 parts In-Stock

1+ parts

-

100+ parts

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1,971

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Overview

Enhance your consumer electronic designs with the TWL1101GGV by Texas Instruments, a high-quality and reliable consumer circuit IC. Manufactured by Texas Instruments, a renowned leader in the industry, this IC offers exceptional performance and durability. With its compact square package shape and surface mount design, it is versatile for various applications. Whether you are designing smartphones, tablets, or other consumer electronics, this IC provides value by ensuring efficient operation and optimal functionality. Upgrade your designs with the TWL1101GGV and experience the benefits of superior quality and advanced technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and good thermal conductivity, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort during production.

Package Shape: SQUARE

Square package shape helps in optimizing space utilization on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature enables the product to withstand demanding environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures functionality in both extreme cold and hot environments.

Maximum Seated Height: 1.4 mm

Low profile design with maximum seated height of 1.4 mm allows for a compact overall product size, ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage requirement provides energy efficiency and compatibility with a wide range of power sources.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments where temperature fluctuations are common.

Terminal Form: BALL

Ball terminal form provides reliable connections and efficient heat dissipation, enhancing the overall performance and longevity of the product.

Maximum Supply Voltage (Vsup): 3.5 V

Moderate maximum supply voltage allows for flexibility in power supply selection while ensuring safe operation of the product.

Technical Specifications

Other Function Consumer ICs TWL1101GGV attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B64

Length:

8 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

11 mA

Maximum Supply Voltage (Vsup):

3.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

TWL1101GGV General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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