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TWL1110GQE

Texas Instruments

TWL1110GQE by Texas Instruments

TWL1110GQE by Texas Instruments is a consumer IC with 80 terminals in a square grid array package. It operates b/w -40 to 85°C, with supply voltage ranging from 2.7V to 3.3V and max current of 6mA. Ideal for industrial applications requiring fine pitch and thin profile components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

7,184

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-

-

-

Digiode

USA . 3,073 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,073

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 652 parts In-Stock

1+ parts

$0.925

100+ parts

-

1k+ parts

$1.840

10k+ parts

-

652

$0.925

-

$1.840

-

DigiPath Technology Company

USA . 2,286 parts In-Stock

1+ parts

$1.018

100+ parts

$0.937

1k+ parts

-

10k+ parts

-

2,286

$1.018

$0.937

-

-

ChromeModa Solutions

Germany . 6,175 parts In-Stock

1+ parts

$1.039

100+ parts

$0.852

1k+ parts

-

10k+ parts

-

6,175

$1.039

$0.852

-

-

IDEA Electronic Components Group

UK . 1,525 parts In-Stock

1+ parts

$1.039

100+ parts

-

1k+ parts

$0.935

10k+ parts

-

1,525

$1.039

-

$0.935

-

AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$5.436

100+ parts

-

1k+ parts

-

10k+ parts

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223

$5.436

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-

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One Stop Electronics

USA . 1,206 parts In-Stock

1+ parts

$17.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,206

$17.800

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-

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Corphita

USA . 2,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,737

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Overview

Experience unparalleled quality and performance with the TWL1110GQE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers cutting-edge technology for consumer ICs, ensuring reliability and precision. This versatile product is suitable for a wide range of applications, providing customers with endless possibilities. With its sleek design and advanced features, the TWL1110GQE delivers exceptional value, efficiency, and convenience. Elevate your projects with this top-of-the-line component and experience the difference Texas Instruments can make in your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the IC.

Surface Mount: YES

Enables easy and efficient placement on PCBs during manufacturing.

Package Shape: SQUARE

Allows for uniform distribution of terminals and efficient use of space on the PCB.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments where high temperatures may be present.

Terminal Position: BOTTOM

Facilitates easy connection to other components on the PCB.

Minimum Supply Voltage (Vsup): 2.7 V

Can operate at low voltage levels, saving energy.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh environmental conditions in industrial settings.

Technical Specifications

Other Function Consumer ICs TWL1110GQE attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B80

Length:

5 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current:

6 mA

Maximum Supply Voltage (Vsup):

3.3 V

Minimum Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

TWL1110GQE General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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